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Novel Ballistic Processing of Sn-0.7Cu Thick Films

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Abstract

The present paper discusses a novel process (Ballistic Processing) for the ultra-rapid processing of textured and un-textured thick and potentially thin films. The effect of processing velocity (14.6 to 36.1 m/s) on the developed external structure and internal microstructure of Sn-0.7Cu thick film is discussed. Film thicknesses ranging from 6.08 to 12.79 μm were produced and characterized by two-dimensional hypoeutectic microstructures. Both film thickness and dendrite arm spacing decreased with an increase in processing velocity.

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The authors wish to thank The National Science Foundation (major research instrumentation (MRI) Grant DBI-0959908) for the field emission scanning electron microscope. The authors express their thanks also to Dr. Steve Barlow for his assistance with the FESEM work. The authors express their thanks to Mr. Greg Morris for general technical support. We would like to also thank ASCO Neumatics Inc. for supplying the high-speed high-pressure solenoid valve used for this project.

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Authors and Affiliations

  1. Department of Mechanical Engineering, San Diego State University, 5500 Campanile Drive, San Diego, CA, 92182, USA

    D. Cavero (Former MS Student), K. Stewart (MS Student) & K. Morsi (Professor)

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  1. D. Cavero
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  2. K. Stewart
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  3. K. Morsi
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Correspondence to K. Morsi.

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Manuscript submitted March 31 2016.

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Cavero, D., Stewart, K. & Morsi, K. Novel Ballistic Processing of Sn-0.7Cu Thick Films. Metall Mater Trans A 48, 46–50 (2017). https://doi.org/10.1007/s11661-016-3838-3

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