Skip to main content
SpringerLink
Log in

Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

  • Communication
  • Published:
Metallurgical and Materials Transactions A Aims and scope Submit manuscript

Abstract

The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar’s morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5

References

  1. J.H. Lau: Flip Chip Technologies, McGraw-Hill, New York, 1996.

    Google Scholar 

  2. K.N. Tu and K. Zeng: Mater. Sci. Eng., 2001, vol. R34, pp. 1-58.

    Article  Google Scholar 

  3. K.Z. Wang and C.M. Chen: J. Electron. Mater., 2005, vol. 34, pp. 1543-1549.

    Article  Google Scholar 

  4. Y.S. Lai, Y.T. Chiu, and J. Chen: J. Electron. Mater., 2008, vol. 37, pp. 1624-1630.

    Article  Google Scholar 

  5. Y.J. Chen, C.K. Chung, C.R. Yang, and C.R. Kao: Microelectron. Reliab., 2013, vol. 53, pp. 47-52.

    Article  Google Scholar 

  6. J.C. Lin, Y. Qin, and J. Woertink: J. Electron. Mater., 2014, vol. 43, pp. 4134-4145.

    Article  Google Scholar 

  7. A. Yeoh, M. Chang, C. Pelto, T.L. Huang, S. Balakrishnan, G. Leatherman, S. Agraharam, G. Wang, Z. Wang, D. Chiang, P. Stover, and P. Brandenburger: IEEE Proceedings of Electronic Components and Technology Conference, 2006, pp. 1611–15.

  8. J. Yu, A. Anand, Y.C. Mui, P. Srinivasan, and R. Master: IEEE Proceedings of Electronics Packaging Technology Conference, 2007, pp. 618–22.

  9. C.M. Chen, K.Z. Wang, and K.C. Chen: J. Alloys Compd, 2007, vol. 432, pp. 122-128.

    Article  Google Scholar 

  10. H.Y. Chuang, T.L. Yang, M.S. Kuo, Y.J. Chen, J.J. Yu, C.C. Li, and C.R. Kao: IEEE Trans. Device Mater. Reliab., 2012, vol. 12, pp. 233-240.

    Article  Google Scholar 

Download references

This work was supported in part by the Ministry of Science and Technology of Taiwan and in part by the Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan.

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, 300, Taiwan, ROC

    Hsi-Kuei Cheng (Ph.D. Student) & Tzeng-Feng Liu (Professor)

  2. Department of Chemical Engineering, National Chung Hsing University, Taichung, 402, Taiwan, ROC

    Yu-Jie Lin (Ph.D. Student), Hou-Chien Chang (Associate Professor) & Chih-Ming Chen (Professor)

  3. Backend Operation Division, Taiwan Semiconductor Manufacturing Company, Ltd, Hsinchu, Taiwan, ROC

    Kuo-Chio Liu (Director)

  4. Institute of Lighting and Energy Photonics, National Chiao Tung University, Hsinchu, 300, Taiwan, ROC

    Ying-Lang Wang (Professor)

Authors
  1. Hsi-Kuei Cheng
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yu-Jie Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Hou-Chien Chang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Kuo-Chio Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Ying-Lang Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Tzeng-Feng Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Chih-Ming Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Ying-Lang Wang, Tzeng-Feng Liu or Chih-Ming Chen.

Additional information

Manuscript submitted December 3, 2014.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Cheng, HK., Lin, YJ., Chang, HC. et al. Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing. Metall Mater Trans A 46, 1834–1837 (2015). https://doi.org/10.1007/s11661-015-2825-4

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11661-015-2825-4

Keywords

Search

Navigation