Ag-4Pd binary alloy wire has been produced as an alternative to a previously developed Ag-8Au-3Pd ternary alloy wire to meet requirements for high electrical conductivity and low cost. The electrical resistivity of this Ag-4Pd bonding wire, manufactured with a conventional method, is 3.7 μΩ cm, close to the values of traditional 3N Au wire (3.5 μΩ cm) and Pd-coated Cu wire (1.8 μΩ cm). To further improve the performance of this bonding wire, a large amount of annealing twins were introduced in this Ag-4Pd alloy wire through an innovative concept of sequential drawing and multiple annealing processes. The resulting electrical resistivity of this annealing-twinned Ag-4Pd wire is 3.5 μΩ cm. In contrast to the apparent increase in grain size in the conventional Ag-4Pd wire under electrical stressing with a current density of 1.23 × 105 A/cm2 for various times, the grains in this annealing-twinned wire grow much more slowly. The breaking load and elongation of this annealing-twinned Ag-4Pd wire are also higher than those of conventional wire. Furthermore, annealing twins increase the durability to electromigration of this Ag-4Pd wire under electrical stressing with various current densities.
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This study was sponsored by a cooperative program of the National Science Council and Wire Technology, Taiwan, under Grant No. NSC-102-2622-E002-019-CC2.
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Chuang, TH., Lin, HJ., Chuang, CH. et al. Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing. Metall Mater Trans A 45, 5574–5583 (2014). https://doi.org/10.1007/s11661-014-2538-0
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DOI: https://doi.org/10.1007/s11661-014-2538-0