Effects of Thermal and Cryogenic Conditionings on Flexural Behavior of Thermally Shocked Cu-Al₂O₃ Micro and NanoComposites

Abstract

This investigation has used flexural test to explore the effects of thermal treatments, i.e., high-temperature and cryogenic environments on the mechanical property of Al₂O₃ particulate-reinforced Cu metal matrix micro and nanocomposites in ex-situ and in-situ conditions. Cu-5 vol. pct Al₂O₃ micro (10 μm)- and nanocomposites (<50 nm) fabricated by powder metallurgy route were subjected to up-thermal shock cycle [193 K to 353 K (−80 °C to 80 °C)] and down-thermal shock cycle [353 K to 193 K (from 80 °C to −80 °C)] for different time periods followed by 3-point bend test. One batch of specimens (micro and nanocomposites) was conditioned at 353 K and 193 K (80 °C and −80 °C) separately followed by 3-point flexural test. High-temperature flexural test was performed at 373 K and 523 K (80 °C and 250 °C) on the micro and nanocomposites. All the fractured samples obtained after various thermal treatments were studied under scanning electron microscope (SEM). The development of thermal stresses quite often results in concentration of residual stresses at the particle/matrix interface eventually weakening it. Enhancement of flexural strength was recorded for down- as well as for up-thermal shock in microcomposites. The high-temperature flexural strengths of micro and nanocomposites are lower than those at ambient temperature. The amelioration and declination in mechanical properties as a consequence of thermal shock, thermal conditioning, and high-temperature flexural testing have been discussed in the light of fractography.