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The Kinetics of and the Microstructure Induced by the Recrystallization of Copper

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Abstract

The kinetics of the recrystallization of pure copper was investigated by differential scanning calorimetry (DSC). The associated microstructural change was characterized by electron backscatter diffraction imaging (EBSD), by analyzing deformed specimens before recrystallization and specimens after partial recrystallization and after completed recrystallization. The experimental results acquired by the two methods were compared with each other and discussed in the context of the available body of literature results. The observed kinetics deviate from Johnson–Mehl–Avrami–Kolmogorov (JMAK)-like behavior. The observed grain-area distribution is unusually broad and skewed toward large grains. Comparison with mesoscopic, geometric simulations showed that previously proposed (simple) models fail to correctly describe the microstructure resulting from recrystallization, although they can successfully model the recrystallization kinetics. It was concluded that the experimental results on both the kinetics and the microstructure can be reconciled employing a recrystallization model incorporating ongoing (i.e., beyond time t = 0) nucleation and accounting for the inhomogeneous nature of the deformed material.

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Notes

  1. It must be recognized that nucleation in recrystallization is not the outcome of a fluctuation phenomenon as in heterogeneous phase transformations. Instead, the “nuclei” are already present in the deformed material (as subgrains[3]) and can become “activated” subject to instability criteria.[3–5] Nevertheless, the moment a (sub-) grain starts to grow is denoted "nucleation."

  2. This refers to recrystallization that occurs during annealing after deformation and not (dynamically) during deformation.

  3. The growth exponent n can also be determined from isochronally (i.e., with constant heating rate) conducted experiments. To this end, an appropriately adapted variant of the JMAK equation has to be applied and then n is the negative of the slope of the straight line possibly observed in a plot of \(\ln(-\ln(1-f))\) vs \(\ln \Upphi\) (with \(\Upphi\) as the heating rate). Refer to Section 9.6.15.5 in Ref. 13.

  4. The image quality is a measure of the quality of the backscatter electron diffraction pattern of the material corresponding to one pixel.

  5. It is also possible to use the average orientation spread in a grain to distinguish between recrystallized and unrecrystallized parts of the specimen. In the present study, both methods have been shown to lead to the same results.

  6. If the misorientation between two pixels is smaller than 5°, the pixels are considered to belong to the same grain.

  7. This plot and its analysis are referred to by some authors as the microstructural path method.[15,42]

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Author notes

  1. Eric A. Jägle (Doctoral Student, Postdoctoral Researcher)

    Present address: Max Planck Institute for Iron Research, 40237, Düsseldorf, Germany

Authors and Affiliations

  1. Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), 70569, Stuttgart, Germany

    Eric A. Jägle (Doctoral Student, Postdoctoral Researcher) & Eric J. Mittemeijer (Director, Full Professor)

  2. Institute for Materials Science, University of Stuttgart, 70569, Stuttgart, Germany

    Eric J. Mittemeijer (Director, Full Professor)

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  1. Eric A. Jägle
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Correspondence to Eric A. Jägle.

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Manuscript submitted April 26, 2011.

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Jägle, E.A., Mittemeijer, E.J. The Kinetics of and the Microstructure Induced by the Recrystallization of Copper. Metall Mater Trans A 43, 1117–1131 (2012). https://doi.org/10.1007/s11661-011-0959-6

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