Abstract
Electromagnetic levitation is applied to achieve containerless solidification of 10-mm-diameter droplets of Al-50 at. pct Si. A maximum undercooling of 320 K is obtained. Phase morphologies on the droplet surfaces and on the deeply etched sections of the samples solidified at different undercoolings are examined by scanning electron microscopy. The primary silicon shows well-developed faceted dendrites at a small undercooling, but a fine granular form at a large undercooling. Stratified deposits of aluminum are found within the primary silicon plates, arising from solute pileup during growth. The microstructural refinement at a large undercooling has its origins in solute restriction of crystal growth and in fragmentation of the primary silicon dendrites. The form of the Al-Si eutectic is also found to be changed into an anomalous form at a large undercooling.
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Liu, R.P., Herlach, D.M., Vandyoussefi, M. et al. Undercooling and solidification of Al-50 at. pct Si Alloy by electromagnetic levitation. Metall Mater Trans A 35, 607–612 (2004). https://doi.org/10.1007/s11661-004-0372-5
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DOI: https://doi.org/10.1007/s11661-004-0372-5