Skip to main content
SpringerLink
Log in

Microstructural, mechanical, electrical, and thermal properties of the Bi-Sn-Ag ternary eutectic alloy

  • Metallic materials
  • Published:
Journal of Wuhan University of Technology-Mater. Sci. Ed. Aims and scope Submit manuscript

Abstract

The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-Sn-Ag ternary eutectic alloy. Bi-47 wt%Sn-0.68 wt%Ag alloy was directionally solidified upward with different temperature gradients (G=2.33-5.66 K/mm) at a constant growth rate (V=13.25 μm/s) and with different growth rates (V=6.55-132.83 μm/s) at a constant temperature gradient (G=2.33 K/mm) in the growth apparatus. The microstructures (λ), microhardness (HV), tensile stress (σ), electrical resistivity (ρ), and thermal properties (ΔH, C p, T m) were measured on directionally solidified samples. The dependency of the λ, HV, σ, and ρ on G and V was investigated. According to the experimental results, λ values decrease with increasing G and V, but HV, λ, and ρ values increase with increasing G and V. Variations of electrical resistivity (ρ) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (ΔH) and specific heat (C p) for the same alloy was also determined by means of differential scanning calorimeter (DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Deng X, Sidhu RS, Johnson P, et al. Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints[J]. Metallurgical and Materials Transactions A, 2005, 36(1): 55–64

    Article  Google Scholar 

  2. He M, Chen Z, Qi GJ. Mechanical Strength of Thermal Aged Sn-3.5Ag/Ni-P Solder Joints[J]. Metallurgical and Materials Transactions A, 2005, 36A: 65–75

    Article  Google Scholar 

  3. Kamal M, El Said Gouda, Marei L K. Effect of Bi-Content on Hardness and Micro-Creep Behavior of Sn-3.5Ag Rapidly Solidified Alloy[J]. Crystal Reseasch and Technology, 2009, 44(12): 1308–1312

    Article  Google Scholar 

  4. Arenas M F, Acoff V L. Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrate[J]. Journal of Electronic Materials, 2004, 33: 1452–1458

    Article  Google Scholar 

  5. Arenas M F, He M, Acoff V L. Effect of Flux on the Wetting Characteristics of SnAg, SnCu, SnAgBi, and SnAgCu Lead-Free Solders on Copper Substrates[J]. Journal of Electronic Materials, 2006, 35: 1530–1536

    Article  Google Scholar 

  6. Çadırlı E, Kaya H, Maraşlı N, et al. The Effect of Growth Rate on Microstructure and Microindentation Hardness in the In-Bi-Sn Ternary Alloy at Low Melting Point[J]. Journal of Alloys and Compounds, 2009, 470,150-156

    Google Scholar 

  7. Smiths M. Masurement of Sheet Resistivities with the Four-Point Probe[J]. The Bell System Techonology, 1958, 37: 711

    Article  Google Scholar 

  8. Aker A, Kaya H. Measurements of Microstructural, Mechanical, Electrical, and Thermal Properties of an Al–Ni Alloy[J]. International Journal of Thermophys, 2013, 34: 267–283

    Article  Google Scholar 

  9. Aresa A E, Gueijmanb S F, Caramc R, et al. Analysis of Solidification Parameters During Solidification of Lead and Aluminum Base Alloys[J]. Journal of Crystal Growth, 2005, 275(1): 319–327

    Article  Google Scholar 

  10. Aker A, Engin S, Kaya H. Influence of the Growth Rate on Physical Properties in the Aluminum-Antimony Eutectic Alloy[J]. International Journal of Materials Engineering and Technology, 2013, 9(1): 59–76

    Google Scholar 

  11. Sahin M, Cadırlı E, Kaya H. Influence of the Solidification Parameters on Dendritic Microstructures in Unsteady-State Directionally Solidificationof Lead-Antimony Alloy[J]. Surface Review Letters, 2010, 17: 477

    Article  Google Scholar 

  12. Cadırlı E, Kaya H. Dendritic Growth of the Binary Succinonitrile-Camphor System[J]. Surface Review Letters. 2007, 14: 1169

    Article  Google Scholar 

  13. Jackson K A, Hunt J D. Hunt, Lamellar and Rod Eutectic Growth[J]. Transation Metalliars Society A.I.M.E., 1966, 236: 1129

    Google Scholar 

  14. De Wilde J, Froyen L, Rex S. Coupled Two-Phase [alpha(Al)+theta(Al2Cu)] Planar Growth and Destabilisation Along the Univariant Eutectic Reaction in Al-Cu-Ag Alloys[J]. Scripta Materialia, 2004, 51: 533–538

    Article  Google Scholar 

  15. Witusiewicz VT, Hecht U, Rex S, et al. In Situ Observation of Microstructure Evolution in Low-Melting Bi-In-Sn Alloys by Light Microscopy[J]. Acta Materialia, 2005, 53: 3663–3669

    Article  Google Scholar 

  16. Kaya H, Çadırlı E, Böyük U, et al. Variation of Microindentation Hardness with Solidification and Microstructure Parameters in the Al Based Alloys[J]. Applied Surface Science, 2008, 255(5): 3071–3078

    Article  Google Scholar 

  17. Khan S, Ourdjini A, Hamed Q S, et al. Hardness and Mechanical Property Relationship in Directionally Solidified Aluminium-Silicon Eutectic Alloys with Different Silicon Morphologies[J]. Journal of Materials Science, 1993, 28: 5957–5962

    Article  Google Scholar 

  18. Kaya H, Böyük U, Engin S, et al. Measurements of the Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7 wt%Cu Hypoperitectic Alloy[J]. Journal of Electronic Materials, 2010, 39(3): 303–311

    Article  Google Scholar 

  19. Kaya H, Böyük U, Cadırlı E, et al. Measurements of the Microhardness, Electrical and Thermal Properties of the Al–Ni Eutectic Alloy[J]. Materials Design, 2012, 34: 707–712

    Article  Google Scholar 

  20. Sergeev A, Mitin V. Electron-Phonon Interaction in Disordered Conductors: Static and Vibrating Scattering Potentials[J]. Physical Review B, 2000, 61, 6041–6047

    Article  Google Scholar 

  21. Boekelheide Z, Cooke D W, Helgren E, et al. Resonant Impurity Scattering and Electron-Phonon Scattering in the Electrical Resistivity of Cr Thin Films[J]. Physical Review B, 2009, 80134426–80134438

    Google Scholar 

  22. Rudnev V, Loveless D, Cook R, et al. Handbook of Induction Heating[M]. New York: Markel Dekker Inc. 2003

    Google Scholar 

  23. Hultgren R, Desai P D, Hawkins D T, et al. Selected Values of the Thermodynamic Properties of the Elements[G]. American Society for Metals, OH, USA, 1973

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Faculty of Education, Department of Science Education, Erciyes University, Kayseri, Turkey

    Hasan Kaya & Uğur Büyük

  2. Faculty of Thech, Department of Energy Systems Engineering, DumlupInar Univ., Kütahya, Turkey

    Sevda Engin

  3. Faculty of Education, Department of Computer and Instructional Technologies, Siirt University, Siirt, Turkey

    Aynur Aker

  4. Faculty of Arts and Sciences, Department of Physics, Ömer Halisdemir University, Niğde, Turkey

    Emin Çadirli

Authors
  1. Hasan Kaya
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Sevda Engin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Aynur Aker
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Uğur Büyük
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Emin Çadirli
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Hasan Kaya.

Additional information

Supported by the Erciyes University Scientific Research Project Unit (No. FBA-10-3376)

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kaya, H., Engin, S., Aker, A. et al. Microstructural, mechanical, electrical, and thermal properties of the Bi-Sn-Ag ternary eutectic alloy. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 32, 147–154 (2017). https://doi.org/10.1007/s11595-017-1573-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11595-017-1573-2

Key words

Search

Navigation