Abstract
We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique.
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Ishii H, Kasaya K, Oohashi H, et al. Widely wavelength-tunable DFB laser array integrated with funnel combiner. IEEE J Sel Top Quantum Electron, 2007, 13: 1089–1094
Kish J, Fred A J, Charles H W, et al. Method of operating an array of laser sources integrated in a monolithic chip or in a photonic integrated circuit(PIC). US Patent, US7079720B2, 2002-07-18
Chen X F, Luo Y, Fan C C, et al. Analytical expression of sampled Bragg gratings with chirp in the sampling period and its application in dispersion management design in a WDM system. IEEE Photonics Technol Lett, 2000, 12: 1013–1015
Dai Y T, Chen X F, Xia L, et al. A realization of arbitrary goal response optical fiber Bragg grating. PRC Patent, CN1560656, 2005-01-05
Dai Y T, Chen X F, Xia L, et al. Sampled Bragg grating with desired response in one channel by use of a reconstruction algorithm and equivalent chirp. Opt Lett, 2004, 29: 1333–1335
Jiang D J, Chen X F, Dai Y T, et al. A novel distributed feedback fiber laser based on equivalent phase shift. IEEE Photonics Technol Lett, 2004, 16: 2598–2600
Dai Y T, Chen X F, Sun J, et al. High-performance, high-chip-count optical code division multiple access encoders-decoders based on a reconstruction-equivalent-chirp technique. Opt Lett, 2006, 31: 1618–1620
Chen X F. The method and device for fabricating semiconductor lasers based on reconstruction equivalent chirp technology. PRC Patent, CN101034788, 2007-09-12
Dai Y T, Chen X F. DFB semiconductor lasers based on reconstruction-equivalent-chirp technology. Opt Express, 2007, 15: 2348–2353
Dai Y T, Yao J P. Numerical study of a DFB semiconductor laser and laser array with chirped structure based on the equivalent chirp technology. IEEE J Quantum Electron, 2008, 44: 938–945
Li J S, Wang H, Chen X F, et al. Experimental demonstration of distributed feedback semiconductor lasers based on reconstructionequivalent-chirp technology. Opt Express, 2009, 17: 5240–5245
Li J S, Chen X F, Zhou N, et al. Monolithically integrated 30-wavelength DFB laser array. In: He J J, Duan G H, Koyama F, et al., eds. Proceedings of SPIE-OSA-IEEE Asia Communications and Photonics, SPIE 7631 763104, 2009 Nov25–29, Shanghai
Li S M, Shi Y C, Li J S, et al. Experimental demonstration of the corrugation pitch modulated DFB semiconductor laser based on the reconstruction-equivalent-chirp technology. In: Koyama F, Chuang S L, Duan G H, et al., eds. Proceedings of SPIE-OSA-IEEE Asia Communications and Photonics, SPIE 7987, 798704, 2010 Dec9–12, Shanghai
Shi Y C, Tu X H, Li S M, et al. Numerical study of three phase shift and dual corrugation pitch modulated DFB semiconductor lasers based on reconstruction equivalent chirp technology. Chinese Sci Bull, 2010, 55: 1944–1950
Shi Y C, Li S M, Lu L L, et al. Multiple phase shifts DFB semiconductor laser based on reconstruction equivalent chirp technology. In: Zhu N H, Li J, Amzajerdian F, et al., eds. Proceedings of SPIE 7844 784418, 2010 Nov18–20, Beijing
Huang Y D, Sato K, Okuda T, et al. Low-chirp and external optical feedback resistant characteristics in λ/8 phase-shifted distributedfeedback laser diodes under direct modulation. IEEE J Quantum Electron, 2002, 38: 1479–1484
Li J S, Cheng Y, Yin Z W, et al. A multiexposure technology for sampled Bragg gratings and its applications in dual-wavelength lasing generation and OCDMA en/decoding. IEEE Photonics Technol Lett, 2009, 21: 1639–1641
Zhou Y T, Shi Y C, Li S M, et al. Asymmetrical sampling structure to improve the single-longitudinal-mode property based on reconstruction-equivalent-chirp technology. Opt Lett, 2010, 35: 3123–3125
Chou S Y, Krauss P R, Renstrom P J, et al. Imprint of sub-25 nm vias and trenches in polymer. Appl Phys Lett, 1995, 67: 3114–3116
Chou S Y, Krauss P R, Zhang W, et al. Sub-10 nm imprint lithography and applications. J Vac Sci Technol B, 1997, 15: 2897–2904
Hong P S, Lee H H. Pattern uniformity control in room-temperature imprint lithography. Appl Phys Lett, 2003, 83: 2441–2443
Hua F, Gaur A, Sun Y, et al. Processing dependent behavior of soft imprint lithography on the 1–10-nm scale. IEEE Trans nanotechnol, 2006, 5: 301–308
Liu W, Wang D L, Zhou N, et al. Second imprint template and the fabrication method for second imprint template for nano imprinting. PRC Patent, CN101446759, 2009-06-03
Koch T L, Koren U. Semiconductor photonicintegrated circuits, IEEE J Quantum Electron, 1991, 27: 641–653
Yuzo, Semiconductor arrayed waveguide gratings for photonic integrated devices. IEEE J Sel Top Quantum Electron, 2002, 8: 1102–1114
Welch D F, Kish F A, Nagarajan R. The realization of large-scale photonic integrated circuits and the associated impact on fiber-optic communication systems. J Lightwave Technol, 2006, 24: 4674–4683
Zhu N H, Chen C, Pun E Y B, et al. Extraction of intrinsic response from S-parameters of laser diodes. IEEE Photonics Technol Lett, 2005, 17: 744–746
Zhang S J, Zhu N H, Liu Y, et al. Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules. Opt Quantum Electron, 2006, 38: 675–682
Zhang Y, Silvonen K, Zhu N H. Measurement of a reciprocal four-port transmission line structure using the 16-term error model. Microw Opt Technol Lett, 2007, 49: 1511–1515
Zhu N H, Hou G H, Huang H P, et al. Electrical and optical coupling in an electro-absorption modulator integrated with a DFB laser. IEEE J Quantum Electron, 2007, 43: 535–544
Gnitabourk Y. Effect of relatively strong light injection on the chirp-to-power ratio and 3-dB bandwidth of directly modulated semiconductor lasers. J Lightwave Technol, 1996, 14: 2367–2373
Nakagawa G, Kai Y, Yoshida S, et al. Novel optical coupling technique for enhancing the performance of integrated 8-input/1-output SOA gate-switch module. J Lightwave Technol, 2009, 27: 4989–4994
Wang X, Xie L, Yuan H Q, et al. Butterfly package devices for semiconductor lasers. PRC Patent, CN1937336, 2007-03-28
Tsuzuki K, Kawaguchi Y, Kondo S, et al. Four-channel arrayed polarization independent EA modulator with an IPF carrier operating at 10 Gb/s. IEEE Photonics Technol Lett, 2000, 12: 281–283
Zhu N H, Liu Y, Zhang S J, et al. Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices. Microw Opt Technol Lett, 2006, 48: 76–79
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Chen, X., Liu, W., An, J. et al. Photonic integrated technology for multi-wavelength laser emission. Chin. Sci. Bull. 56, 3064 (2011). https://doi.org/10.1007/s11434-011-4677-7
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DOI: https://doi.org/10.1007/s11434-011-4677-7