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Theoretical study on the influence of residual stress on adhesion-induced instability in MEMS

  • Articles/Solid-State Mechanics
  • Published:
Chinese Science Bulletin

Abstract

Adhesion and residual stress play a critical role in the performance and reliability of MEMS. The influence of residual stress on the adhesion-induced instability in MEMS is examined within the framework of thin elastic plate theory. The results show that the adhesion-induced instability will be mitigated if the residual stress exists in certain component of MEMS. Moreover, we find that the influence is significant only when the residual stress is under a proper magnitude (β⩽20).

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References

  1. Huan Y, Zhang T H, Yang Y M. In-plane load measuring technique for the strength test of MEMS micro-cantilever. Chinese Sci Bull, 2006, 51: 2819–2823

    Article  Google Scholar 

  2. Maboudian R, Howe R T. Critical review: Adhesion in surface micromechanical structures. J Vac Sci Tech B, 1997, 15: 1–20

    Article  Google Scholar 

  3. Mastrangelo C H. Adhesion-related failure mechanisms in micromechanical devices. Tribol Lett, 1997, 3: 223–238

    Article  Google Scholar 

  4. Zhao Y P, Wang L S, Yu T X. Mechanics of adhesion in MEMS-a review. J Adhes Sci Tech, 2003, 17: 519–546

    Article  Google Scholar 

  5. Rogers J W, Mackin T J, Phinney L M. A thermomechanical model for adhesion reduction of MEMS cantilevers. J Micromech Microeng, 2002, 11: 512–520

    Google Scholar 

  6. Jones E E, Begley M R, Murphy K D. Adhesion of micro-cantilevers subjected to mechanical point loading: Modeling and experiments. J Mech Phys Solids, 2003, 51: 1601–1622

    Article  Google Scholar 

  7. Lin M J, Chen R S. Adhesion criterion for center-anchored circular plates in microstructures. Sensors Actuat A-Phys, 2002, 101: 14–23

    Article  Google Scholar 

  8. Yang F Q. Adhesive contact of axisymmetric suspended miniature structure. Sensors Actuat A-Phys, 2003, 104: 44–52

    Article  Google Scholar 

  9. Yang F Q. Contact deformation of a micromechanical structure. J Micromech Microeng, 2004, 14: 263–268

    Article  Google Scholar 

  10. Serry F M, Walliser D, Maclay G J. The role of the Casimir effect in the static deflection and stiction of membrane strips in microelectromechanical systems. J Appl Phys, 1998, 84: 2501–2506

    Article  Google Scholar 

  11. Su Y H, Chen K S, Roberts D C, et al. Large deflection analysis of a pre-stressed annular plate with a rigid boss under axisymmetric loading. J Micromech Microeng, 2001, 11: 645–653

    Article  Google Scholar 

  12. Wan K T, Kogut L. The coupling effect of interfacial adhesion and tensile tension residual stress on a thin membrane adhered to a flat punch. J Micromech Microeng, 2005, 15: 778–784

    Article  Google Scholar 

  13. Ding J N, Meng Y G, Wen S Z. Scale dependence of tensile strength of micromachined polysilicon MEMS structures due to microstructural and dimensional constraints. Chinese Sci Bull, 2001, 46: 1392–1397

    Article  Google Scholar 

  14. Yang F Q. Electromechanical instability of microscale structures. J Appl Phys, 2002, 92: 2789–2794

    Article  Google Scholar 

  15. Timoshenko S P, Woinowsky-Krieger S. Theory of Plates and Shells. New York: McGraw-Hill Press, 1959

    Google Scholar 

  16. Wan K T, Duan J. Adherence of a rectangular flat punch onto a clamped plate: Transition from a rigid plate to a flexible membrane. J Appl Mech, 2002, 69: 104–109

    Article  Google Scholar 

  17. Lu C F, Chen W Q, Zhong Z. Two-dimensional thermoelasticity solution for functionally graded thick beams. Sci China Ser G, 2006, 49: 451–460

    Article  Google Scholar 

  18. Wang S J, Li X. The effects of tensile residual stress and sliding boundary on measuring the adhesion work of membrane by pull-off test. Thin Solid Films, 2007, 515: 7227–7231

    Article  Google Scholar 

  19. Sun Z, Wan K T, Dilard D A. A theoretical and numerical study of thin film delamination using the pull-off test. Int J Solids Struct, 2004, 41: 717–730

    Article  Google Scholar 

  20. Duan J, Wan K T, Chian K S. Mechanical integrity and adhesion of thin films for applications inelectronics packaging and cell biology. Thin Solid Films, 2003, 424: 120–124

    Article  Google Scholar 

  21. Zhang Y, Zhao Y P. An effective method of determining the residual stress gradients in a micro-cantilever. Microsyst Tech, 2006, 12: 357–364

    Article  Google Scholar 

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Authors and Affiliations

  1. College of Engineering and Technology, Southwest University, Chongqing, 400716, China

    ShiJi Wang & Xian Li

  2. Logistic Engineering University of PLA, Chongqing, 400041, China

    ShiJi Wang & ZhengHan Chen

Authors
  1. ShiJi Wang
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  2. Xian Li
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  3. ZhengHan Chen
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Corresponding author

Correspondence to ShiJi Wang.

Additional information

Supported by the Doctoral Foundation of Southwest University (Grant No. SWUB2007026)

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Wang, S., Li, X. & Chen, Z. Theoretical study on the influence of residual stress on adhesion-induced instability in MEMS. Chin. Sci. Bull. 54, 2606–2609 (2009). https://doi.org/10.1007/s11434-009-0379-9

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  • DOI: https://doi.org/10.1007/s11434-009-0379-9

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