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Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review

  • Invited Review
  • Special Topic: Microscopic Mechanism for Manipulating Thermal Conduction
  • Published:
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Abstract

With the explosive development in integration of electronic components and the increasing complexity of packaging systems, semiconductor chips own extremely high operation temperatures given by the horrible heat accumulation attributed to the drastically increasing power density. Therefore, highly efficient heat dissipation with the help of rationally designed thermal interface materials (TIMs) is the key to maintaining the device performance and lifespan. Graphene exhibits an ultrahigh intrinsic thermal conductivity, which has attracted a large amount of academic interest due to its significant potential for developing high-performance TIMs. In this tutorial review, we summarize the recent advances in graphene-based TIMs, especially emphasizing the determinate effects of graphene structure and alignment in enhancing the heat transfer capacity of corresponding samples, with detailed discussion in the superiorities and limitations of various graphene skeletons. In addition, we also provide prospects for the challenges and opportunities in the future development of graphene-based TIMs.

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Funding

This work was supported by the National Natural Science Foundation of China (Grant Nos. 52075527, U1709205, and 52102055), National Key R&D Program of China (Grant Nos. 2017YFB0406000, and 2017YFE0128600), Project of the Chinese Academy of Sciences (Grant Nos. XDC07030100, XDA22020602, ZDKYYQ20200001, and ZDRW-CN-2019-3), CAS Youth Innovation Promotion Association (Grant No. 2020301), Science and Technology Major Project of Ningbo (Grant Nos. 2021Z120, 2021Z115, 2022Z084, 2018B10046, and 2016S1002), Natural Science Foundation of Ningbo (Grant No. 2017A610010), Foundation of State Key Laboratory of Solid lubrication (Grant No. LSL-1912), China Postdoctoral Science Foundation (Grant Nos. 2020M681965, and 2022M713243), National Key Laboratory of Science and Technology on Advanced Composites in Special Environments (Grant No. 6142905192806), K. C. Wong Education Foundation (Grant No. GJTD-2019-13), and 3315 Program of Ningbo for financial support.

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Author notes

  1. These authors contributed equally to this work.

Authors and Affiliations

  1. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, China

    Junfeng Ying, Wen Dai, Jinhong Yu, Nan Jiang, Cheng-Te Lin & Qingwei Yan

  2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China

    Junfeng Ying, Wen Dai, Jinhong Yu, Nan Jiang, Cheng-Te Lin & Qingwei Yan

  3. Qianwan Institute, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, China

    Qingwei Yan

Authors
  1. Junfeng Ying
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  2. Wen Dai
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  3. Jinhong Yu
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  4. Nan Jiang
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  5. Cheng-Te Lin
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  6. Qingwei Yan
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Corresponding authors

Correspondence to Wen Dai, Cheng-Te Lin or Qingwei Yan.

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Ying, J., Dai, W., Yu, J. et al. Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review. Sci. China Phys. Mech. Astron. 65, 117005 (2022). https://doi.org/10.1007/s11433-022-2004-8

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  • DOI: https://doi.org/10.1007/s11433-022-2004-8

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