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An investigation on application potentiality of microstructure heat sinks with different flow topological morphology

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Abstract

Microstructure heat sinks have great potential for high heat flux cooling. In this paper, we compared microchannel (MC), micro-pin-fin (MPF), manifold microchannel (MMC), and manifold micro-pin-fin (MMPF) heat sinks to figure out the pros and cons. Fluid flow and manifold unit models are used to study thermal and hydrodynamic performance. The heat sinks with different channel/fin sizes, manifold numbers, and porosities are discussed according to the pressure drop, temperature, thermal resistance, and coefficient of performance. Results show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks, and there are also differences between MMC and MMPF heat sinks. Typically, the MMPF heat sink has lower maximum temperature, temperature non-uniformity, and total thermal resistance Rtot. In contrast, the MMC heat sink has a lower pressure drop and higher COP. For the MMPF heat sink, at the nozzle width of 6.75 µm and the MPF width of 70.71 µm (porosity = 0.167), it achieves the lowest total thermal resistance of Rtot = 2.97 × 10−6 K m2/W. Under 103 W/cm2 heat flux, the maximum surface temperature rise is 29.74 K, and the maximum temperature difference of the heating surface is 3.15 K. This research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra high heat flux dissipation.

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Authors and Affiliations

  1. Key Laboratory of Power Station Energy Transfer Conversion and System of MOE, North China Electric Power University, Beijing, 102206, China

    XiaoLe Yao, QianLei Shi, Qian Liu, Le Qin, Xing Ju & Chao Xu

Authors
  1. XiaoLe Yao
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  2. QianLei Shi
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  3. Qian Liu
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  4. Le Qin
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  5. Xing Ju
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  6. Chao Xu
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Corresponding author

Correspondence to Xing Ju.

Additional information

This work was supported by the National Natural Science Foundation of China (Grant No. 51876062), and the Interdisciplinary Innovation Program of North China Electric Power University.

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Yao, X., Shi, Q., Liu, Q. et al. An investigation on application potentiality of microstructure heat sinks with different flow topological morphology. Sci. China Technol. Sci. 65, 2895–2909 (2022). https://doi.org/10.1007/s11431-022-2071-9

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  • DOI: https://doi.org/10.1007/s11431-022-2071-9

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