Skip to main content
SpringerLink
Log in

MD simulation of nanometric cutting of copper with and without water lubrication

  • Article
  • Published:
Science China Technological Sciences Aims and scope Submit manuscript

Abstract

Three-dimensional molecular dynamics (MD) simulation was carried out to understand the mechanism of water lubrication in nanometric cutting. The water-lubricated cutting was compared with the dry cutting process in terms of lattice deformation, cutting force, heat and pressure distribution, and machined surface integrity. It was found that water molecules effectively reduce the friction between the tool and workpiece, the heat in the cutting zone and the pressure being generated on the tool surface, thus leading to prolonged tool life. Water molecules also enlarged the pressure-affected area, which decreased the roughness of the machined surface.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. De C L, Kunzmann H, Peggs G N, et al. Surfaces in precision engineering, microengineering and nanotechnology. CIRP Ann Manuf Technol, 2003, 52: 561–577

    Article  Google Scholar 

  2. Yan J, Syoji K, Tamaki J. Some observation on the wear of diamond tools in ultra-precision cutting of single-crystal silicon. Wear, 2003, 255: 1380–1387

    Article  Google Scholar 

  3. Komanduri R, Raff L M. A review on the molecular dynamics simulation of machining at the atomic scale. P IMechE, Part B, 2001, 215: 1639–1643

    Article  Google Scholar 

  4. Zarudi I, Zhang L C, Swain M V. Effect of water on the mechanical response of monocrystalline silicon to repeated micro-indentation. Key Eng Mater, 2003, 233: 609–614

    Article  Google Scholar 

  5. Tang C Y, Zhang L C. A molecular dynamics analysis of the mechanical effect of water on the deformation of silicon monocrystals subjected to nano-indentation. Nanotechnology, 2005, 16: 15–20

    Article  MathSciNet  Google Scholar 

  6. Chen R L, Liang M, Luo J B. Comparison of surface damage under dry and wet impact: Molecular dynamics simulation. Appl Surf Sci, 2011, 258: 1756–1761

    Article  Google Scholar 

  7. Rentsch R, Inasaki I. Effects of fluids on the surface generation in material removal processes-molecular dynamics simulation. CIRP Ann Manuf Technol, 2006, 55: 601–604

    Article  Google Scholar 

  8. Plimpton S, Fast parallel algorithms for short-range molecular dynamics. J Comp Phys, 1995, 117: 1–19

    Article  MATH  Google Scholar 

  9. Humphrey W, Dalke A, Schulten K. VMD-visual molecular dynamics. J Molec Graphics, 1995, 14: 33–38

    Article  Google Scholar 

  10. Li J. Modelling simulation. Mater Sci Eng, 2003, 11: 173–179

    MATH  Google Scholar 

  11. Nose S. A unified formulation of the constant temperature molecular-dynamics methods. J Chem Phys, 1984, 81: 511–519

    Article  Google Scholar 

  12. Daw M S, Baskes M. Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metals. Phys Rev B, 1984, 29: 6443–6453

    Article  Google Scholar 

  13. Morse P M. Diatomic molecules according to the wave mechanics. II. Vibrational levels. Phys Rev, 1929, 34: 57–64

    Article  MATH  Google Scholar 

  14. Jorgensen W L, Chandrasekhar J, Madura J D, et al. Comparison of simple potential functions for simulating liquid water. J Chem Phys, 1983, 79: 926–935

    Article  Google Scholar 

  15. Rapaport D C. The Art of Molecular Dynamics Simulation. Cambridge: Cambridge Univ Press, 1995

    Google Scholar 

  16. Leach A R. Molecular modelling harlow. Prentice-hall, 2001. 25–27

    Google Scholar 

  17. Hijazi A, Khater A. Brownian dynamics simulations of rigid rod-like macromolecular particles flowing in bounded channels. Comp Mater Sci, 2001, 22: 279–290

    Article  Google Scholar 

  18. Guo Y B, Liang Y C, Chen M J. Molecular dynamics simulations of thermal effects in nanometri ccutting process. Sci China Tech Sci, 2010, 53: 870–874

    Article  MATH  Google Scholar 

  19. Ye Y Y, Biswas R, Morris J R. Molecular dynamics simulation of the nano-scale machining of copper. Nanotechnology, 2003, 14: 390–394

    Article  Google Scholar 

  20. Born M, Huang K. Dynamical Theory of Crystal Lattices. Clarendon: Oxford, 1954. 71–79

    MATH  Google Scholar 

  21. Fang F Z, Wu H, Zhou W, et al. A study on mechanism of nano-cutting single crystal silicon. J Mater Process Tech, 2007, 184: 407–210

    Article  Google Scholar 

  22. Fang F Z, Venkatesh V C. Diamond cutting of silicon with nanometric finish. CIRP Ann Manuf Technol, 1998, 47: 45–49

    Article  Google Scholar 

  23. Heino P, Perondi L, Kaski K. Stacking-fault energy of copper from molecular-dynamics simulation. Phys Rev B, 1999, 60: 14625–14631

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Mechanical and Mining Engineering, the University of Queensland, Brisbane, QLD, 4072, Australia

    YunHui Chen & Huang Han

  2. State Key Laboratory of Precision Measuring Technology & Instruments Centre of MicroNano Manufacturing Technology, Tianjin University, Tianjin, 300072, China

    YunHui Chen, FengZhou Fang & XiaoTang Hu

Authors
  1. YunHui Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Huang Han
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. FengZhou Fang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. XiaoTang Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to FengZhou Fang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Chen, Y., Han, H., Fang, F. et al. MD simulation of nanometric cutting of copper with and without water lubrication. Sci. China Technol. Sci. 57, 1154–1159 (2014). https://doi.org/10.1007/s11431-014-5519-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11431-014-5519-z

Keywords

Search

Navigation