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Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

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Abstract

Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

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Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China

    Feng Tai & Fu Guo

Authors
  1. Feng Tai
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  2. Fu Guo
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Correspondence to Fu Guo.

Additional information

Supported by the New Star Program of Beijing Science and Technology Commission (Grant No.2004B03)

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Tai, F., Guo, F. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint. Sci. China Ser. E-Technol. Sci. 52, 243–251 (2009). https://doi.org/10.1007/s11431-009-0027-2

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  • DOI: https://doi.org/10.1007/s11431-009-0027-2

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