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A Technique for Coupled Thermomechanical Response Measurement Using Infrared Thermography and Digital Image Correlation (TDIC)

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Abstract

An integrated infrared thermography and 3-D digital image correlation (TDIC) technique has been developed which allows for simultaneous measurement of spatial and temporal distributions of temperatures and displacements. For this, a novel technique was developed to calibrate the IR thermal cameras with a stereo-vision digital image correlation (DIC) system using the standard pin-hole stereo calibration model. This method fuses thermal and displacement information and compensates for the difference in camera resolutions. Several high temperature black and white paints were evaluated to determine their characteristics including the temperature-dependent emissivity of each paint, the mixed emissivity of both paints in the speckle pattern, and optical thickness. The advantages of evaluating linked full-field temperatures and strain measurements through the TDIC technique are demonstrated through measurements obtained on an E-glass/vinyl ester/balsa wood sandwich composite subjected to simultaneous one-sided heating and compressive loading.

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Acknowledgments

The authors appreciate the sponsorship related to this work from N00014-13-1-0894 DURIP for the IR camera and DIC equipment, contract monitor Dr. Stephen E. Turner; ONR Grant N00014-12-1-0248 for the sandwich composite measurements, contract monitor Dr. Stephen E. Turner; and the Naval Engineering Education Center under Contract N65540-10-C-0003, Subcontract No. 3002542411-LAT. The authors would also like to thank Correlated Solutions, Inc., notably Micah Simonsen, for discussion and assistance in integrating this system. The authors also thank Mrs. Aslina Anjang and Mr. Robert Ryan at RMIT University for preparing the composite sandwich samples.

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Authors and Affiliations

  1. Department of Biomedical Engineering & Mechanics, Virginia Tech, Blacksburg, VA, 24061, USA

    N. Cholewa & S. W. Case

  2. Department of Mechanical Engineering, Virginia Tech, Blacksburg, VA, 24061, USA

    P. T. Summers & B. Y. Lattimer

  3. School of Aerospace, Mechanical and Manufacturing Engineering, RMIT University, GPO Box 2476, Melbourne, Victoria, 3000, Australia

    S. Feih & A. P. Mouritz

  4. Joining Technology Group, Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore

    S. Feih

  5. 413A Goodwin Hall, Virginia Tech, 635 Prices Fork Road, Blacksburg, VA, 24061, USA

    P. T. Summers

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  1. N. Cholewa
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Correspondence to P. T. Summers.

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Cholewa, N., Summers, P.T., Feih, S. et al. A Technique for Coupled Thermomechanical Response Measurement Using Infrared Thermography and Digital Image Correlation (TDIC). Exp Mech 56, 145–164 (2016). https://doi.org/10.1007/s11340-015-0086-1

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