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Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine

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Abstract

The material properties of an oxygen-free high thermal conductivity (OFHC) film with a thickness of 0.1 mm were evaluated at strain rates ranging from 10−3/s to 103/s using a high-speed material micro-testing machine (HSMMTM). The high strain-rate material properties of thin films are important especially for an evaluation of the structural reliability of micro-formed parts and MEMS products. The high strain-rate material testing methods of thin films, however, have yet to be established to the point that the testing methods of larger specimens for electronics, auto-body, train, ship, and ocean structures are. For evaluation, a new type of HSMMTM was developed to conduct high-speed tensile tests of thin films. This machine is capable of testing at a sufficiently high tensile speed with an electromagnetic actuator, a novel gripping mechanism, and an accurate load measurement system. The OFHC copper film shows high strain-rate sensitivity in terms of the flow stress, fracture elongation, and strain hardening. These measures increase as the tensile strain rate increases. The rate-dependent material properties of an OFHC copper film are also compared with those of a bulk OFHC copper sheet with a thickness of 1 mm. The flow stress of an OFHC copper film is relatively low compared to that of a bulk OFHC copper sheet in the entire range of strain rates, while the fracture elongation of an OFHC copper film is much larger than that of a bulk OFHC copper sheet. A quantitative comparison would provide material data at high strain rates for the design and analysis of micro-appliances and different types of micro-equipment.

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Authors and Affiliations

  1. Railway Structure Research Department, Korea Railroad Research Institute, 360-1, Woram-Dong, Uiwang-Si, Gyeonggi-Do, 437-757, South Korea

    J. S. Kim

  2. School of Mechanical, Aerospace and Systems Engineering, Korea Advanced Institute of Science and Technology, Daeduk Science Town, Daejeon, 305-701, South Korea

    H. Huh

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  1. J. S. Kim
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  2. H. Huh
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Correspondence to H. Huh.

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Kim, J.S., Huh, H. Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine. Exp Mech 51, 845–855 (2011). https://doi.org/10.1007/s11340-010-9395-6

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  • DOI: https://doi.org/10.1007/s11340-010-9395-6

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