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Tensile and Tensile-Mode Fatigue Testing of Microscale Specimens in Constant Humidity Environment

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Abstract

A tensile and tensile-mode-fatigue tester has been developed for testing microscale specimens in high humidity environments in order to investigate the fracture mechanisms of microelectromechanical materials. A humidity control system was installed on a tensile-mode fatigue tester equipped with an electrostatic force grip. A specimen and a griping device were inserted into a small chamber and the humidity was controlled by air flow from a temperature and humidity chamber. The humidity stability was within ±2%RH for humidities in the range 25–90%RH for eight hours of testing. Fatigue tests were performed on single-crystal silicon (SCS) specimens in constant humidity environments and laboratory air for up to 106 cycles. The gauge length, width, and thickness of the SCS specimens were 100 or 500 μm, 13.0 μm, and 3.3 μm, respectively. The average tensile strength was 3.68 GPa in laboratory air; this value decreased in high humidity environments. Fatigue failure was observed during cyclic loading at stresses lower than the average strength. A reduction in the fatigue strength was observed at high relative humidities. Different fracture origins and fracture behaviors were observed in tensile tests and fatigue tests, which indicates that the water vapor in air affects the fatigue properties of SCS specimens.

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Acknowledgments

Part of this work was supported by the Ministry of Education, Science, Sports and Culture, Grant-in-Aid for Young Researchers, 19676002.

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Authors and Affiliations

  1. Department of Micro Engineering, Kyoto University, Yoshida-Honmachi, Sakyo-ku, Kyoto, 606-8501, Japan

    T. Tsuchiya, Y. Yamaji, K. Sugano & O. Tabata

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  1. T. Tsuchiya
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  2. Y. Yamaji
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  3. K. Sugano
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  4. O. Tabata
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Correspondence to T. Tsuchiya.

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Tsuchiya, T., Yamaji, Y., Sugano, K. et al. Tensile and Tensile-Mode Fatigue Testing of Microscale Specimens in Constant Humidity Environment. Exp Mech 50, 509–516 (2010). https://doi.org/10.1007/s11340-009-9258-1

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  • DOI: https://doi.org/10.1007/s11340-009-9258-1

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