Abstract
Micro-tensile properties of Au thin films were measured using a membrane deflection testing system. During the membrane deflection test, the deflection of the film was measured by an out-of-plane electronic speckle pattern interferometric (ESPI) system. From the measurement, the tensile loads and strains exerted on the membrane film during the deflection of the film could be determined. Quantitative analysis of the phase maps of the ESPI speckle patterns corresponding to the respective different deflection levels provided the deflection distribution along the testing section of the film. Test pieces were fabricated by electromachining process using 0.5 and 1. 0 μm thick Au films which were deposited on the silicon wafer by sputtering technique. Tensile properties, including elastic modulus, yield and tensile strength, were evaluated in the tensile stress-strain curve determined from the load-deflection relation. These properties were compared to those obtained from the micro-tensile tests. It was found that the yield and tensile strengths obtained from the deflection tests were lesser than those from the micro-tensile tests. Furthermore, the thickness effect, showing the increasing tendency of yield strength with decreasing thickness, was experimentally examined.
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References
Gad-el-Hak M (2002) The MEMS handbook. CRC
Sharper WN Jr, Yuan B, Edwards RL (1997) A new technique for measuring the mechanical properties of thin films. J Microelectromech Syst 6:193–199
Sutton MA, Wolters WJ, Peters WH, Ranson WF, McNeil SR (1983) Determination of displacements using an improved digital image correlation method. Image Vis Comput 1:133–139. doi:10.1016/0262-8856(83)90064-1
Read DT (1998) Young’s modulus of thin films by Speckle Interferometry. Meas Sci Technol 9:676–685. doi:10.1088/0957-0233/9/4/016
Espinosa HD, Prorok BC, Fisher M (2001) A novel experimental technique for testing thin film and MEMS materials. Proc. of the SEM Annual Con., pp 446–449
Huh Y-H, Kim DI, Kim DJ, Park P, Kee CD, Park JH (2004) Application of micro-ESPI technique for measurement of micro-tensile properties. Key Eng Mater 270:744–749. doi:10.4028/www.scientific.net/KEM.270-273.744
Jensen BD, de Boer MP, Miller SL (1999) IMaP: Interferometry for material property measurement in MEMS. Proceedings of MSM ’99, April, pp 206–209
Robinson DW, Reid GT (1993) Interferogram analysis: digital fringe pattern measurement techniques. IOP, p 108
Cloud GL (1995) Optical method of engineering analysis. Cambridge Univ. Press, p 444
Espinosa HD, Prorok BC (2003) Size effect on the mechanical behavior of gold thin films. J Mater Sci 38:4125–4128. doi:10.1023/A:1026321404286
Nix WD (1989) Mechanical properties of thin films. Metall Trans 20A:2217–2245
ASTM E112-96 Standard test methods for determining average grain size. Linear Intercept Procedure
Acknowledgements
This research was supported by the grant(code #: 06K1501-01110) from ‘Center for Nanostructured Materials Technology’ under ‘21st Century Frontier R&D Programs’ of the Ministry of Science and Technology, Korea, and a research program from KRISS.
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Huh, YH., Kim, DI., Kim, DJ. et al. Measurement of Mechanical Properties of Thin Film by Membrane Deflection Test. Exp Mech 50, 429–435 (2010). https://doi.org/10.1007/s11340-009-9247-4
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DOI: https://doi.org/10.1007/s11340-009-9247-4