The article presents the results of mathematical modeling of copper leakage from a 30 μm-thick near-surface layer of the experimental samples of a W–18% Cu composite (VD-MP grade) as a result of exposure to a hightemperature (1500 K) gas flow caused by the diffusion of copper particles located in the bulk and at the tungsten grain boundaries (GBs) along the latter. The grain-boundary diffusion parameters in this composite are evaluated in the temperature range, where the copper particles are in a liquid state. Using the known experimental data, the value of the high-temperature coefficient of grain-boundary copper diffusion in the polycrystalline tungsten matrix of the composite is calculated within the framework of the constructed computer model. The value of the obtained coefficient D = 7·10–10 m2/s is found to be close to that for diffusion in liquid copper.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 7, pp. 95–98, July, 2022.
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Tokmacheva-Kolobova, A.Y., Tokmachev, M.G., Yanovskii, L.S. et al. Mathematical Modeling of Diffusion-Controlled Processes of the Near-Surface Layer Structure Evolution of W−Cu Composite Under Hightemperature Gas Flow. Russ Phys J 65, 1167–1171 (2022). https://doi.org/10.1007/s11182-022-02746-7
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DOI: https://doi.org/10.1007/s11182-022-02746-7