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Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys

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Powder Metallurgy and Metal Ceramics Aims and scope

Traditionally, the soldering process was carried out, applying mainly lead-based solder materials. However, the prohibition against using lead (Pb) in electronic equipment under the Restriction of Hazardous Substances Directive (RoHS) shifted the focus of research towards developing lead-free alloys. At the same time, tin (Sn) and tin-based alloys became viable alternatives. The development of solder alloys for long-term industrial applications necessitates a methodical characterization of material properties. Thermophysical properties are essential for modeling, designing, and employing lead-free solders to obtain strong joints. Such thermophysical properties as viscosity and density become more and more important as the research in advanced hybrid materials moves forward. This study presents an examination of density and dynamic viscosity in common lead-free solder materials, namely, pure Sn, Sn–3.5Ag, and Sn–3Ag–0.5Cu. The focus of research essentially moved onto the tin-based materials as it has a relatively low melting point and, thus, can serve as an alternative to lead in solder alloy research area and applications. Hence, Sn, Sn–3.5Ag and Sn–3Ag–0.5Cu were selected as research objects. A detailed literature review on the available models for theoretical evaluation of the above materials’ density and dynamic viscosity is provided. The available scientific efforts on dynamic viscosity assessment are extensive, but no specific model was described in the literature as more beneficial than the other. This study allows evaluating the density and dynamic viscosity using different models with the subsequent comparison of the results. Comparative analysis ensures a better model assessment for calculating thermophysical properties and contributes to high-quality modeling and designing of lead-free solder alloys.

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References

  1. Manoj Kumar Pal, Gréta Gergely, Dániel Koncz-Horváth, and Zoltán Gácsi, “Investigation of the Electroless Nickel Plated SiC Particles in SAC305 Solder Matrix,” Powder Metallurgy and Metal Ceramics, 58, No. 9–10, 529–537 (2020).

    Article  CAS  Google Scholar 

  2. P.M. Kumar, G. Gergely, D.K. Horváth, and Z. Gácsi, “Investigating the microstructural and mechanical properties of pure lead-free soldering materials (SAC305 & SAC405),” Powder Metall. Progr., 18, No. 1, 49–57 (2018).

    Article  CAS  Google Scholar 

  3. M.K. Pal, G. Gergely, D. Koncz-Horváth, Z. Gácsi, “Characterization of the interface between ceramics reinforcement and lead-free solder matrix,” Surf. Interf., 20, 100576 (2020).

    Article  CAS  Google Scholar 

  4. M.P. Kumar, G. Gergely, D. Koncz-Horvath, and Z. Gacsi, “Influence of ceramic particles on the microstructure and mechanical properties of SAC305 lead-free soldering material,” Arch. Metall. Mater., 64, 603–606 (2019).

    Google Scholar 

  5. D. Koncz-Horvath, A. Molnar, G. Gergely, M.K. Pal, and Z. Gacsi, “Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques,” Resolut. Discovery, 4, No. 1, 1–6 (2019).

    Article  Google Scholar 

  6. Z. Guo, M. Hindler, W. Yuan, and A. Mikula, “The density and surface tension of In–Sn and Cu–In–Sn alloys,” Monatshefte für Chemie-Chemical Monthly, 142, No. 6, 579–584 (2011).

    Article  CAS  Google Scholar 

  7. T. Gancarz, “Physicochemical properties of Sb–Sn–Zn alloys,” J. Electron. Mater., 43. No. 12, 4374–4385 (2014).

    Article  CAS  Google Scholar 

  8. J. Brillo and I. Egry, “Density determination of liquid copper, nickel, and their alloys,” Int. J. Thermoph. 24, No. 4, 1155–1170 (2003).

    Article  CAS  Google Scholar 

  9. P. Fima, “Surface tension and density of liquid Sn–Ag–Cu alloys,” Int. J. Mater. Research., 103, No. 12, 1455–1461 (2012).

    Article  CAS  Google Scholar 

  10. J. Brillo and I. Egry, “Density and excess volume of liquid copper, nickel, iron, and their binary alloys,” Zeitschrift für Metallkunde, 95, No. 8, 691–697 (2004).

    Article  CAS  Google Scholar 

  11. H. Kobatake, J. Schmitz, and J. Brillo, “Density and dynamic viscosity of ternary Al–Cu–Si liquid alloys,” J. Mater. Sci., 49, No. 9, 3541–3549 (2014).

    Article  CAS  Google Scholar 

  12. A. Dogan and H. Arslan, “Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: dynamic viscosity and surface tension,” Philosophical Magazine, 98, No. 1, 37–53 (2018).

    Article  CAS  Google Scholar 

  13. A. Dogan and H. Arslan, “Theoretical calculation of surface tension and its temperature coefficient associated with liquid Cu–Ti alloys,” Philosophical Magazine, 98, No. 27, 2529–2542 (2018).

    Article  CAS  Google Scholar 

  14. A. Dogan and H. Arslan, “An investigation of influencing of Sb and Bi contents on surface tensions associated with Pb-free Sn–Zn–Sb–Bi quaternary and sub-quaternary solder alloys,” Philosophical Magazine, 99, No. 15, 1825–1848 (2019).

    Article  CAS  Google Scholar 

  15. G. Kaptay, Proc. of MicroCAD Conference, Section of Metallurgy, University of Miskolc (2003), pp. 23–28.

  16. R.I.L. Guthrie and T. Iida, “Thermodynamic properties of liquid metals,” Mater. Sci. Eng.: A, 178, No. 1–2, 35–41 (1992).

    Google Scholar 

  17. L.Ya. Kozlov, L.M. Romanov, and N.N. Petrov, “Prediction of viscosity of multicomponent metal melts,” Izv. Vysch. Uch. Zav., Chern. Metall., 3, No. 7, 7–11 (1983).

    Google Scholar 

  18. M. Kucharski, “The viscosity of multicomponent systems,” Z. Metallkd., 77, 393 (1986).

    CAS  Google Scholar 

  19. D. Sichen, J. Bygd’En, and S. Seetharaman, “A model for estimation of viscosities of complex metallic and ionic melts,” Metall. Mater. Trans. B, 25, No. 4, 519–525 (1994).

    Article  Google Scholar 

  20. X.M. Zhong, Y.H. Liu, K.C. Chou, X.G. Lu, D. Zivkovic, and Z. Zivkovic, “Estimating ternary dynamic viscosity using the thermodynamic geometric model,” J. Phase Equilibria, 24, No. 1, 7–11 (2003).

    Article  CAS  Google Scholar 

  21. S. Morioka, “Evaluation of the dynamic viscosity for binary and ternary liquid alloys,” Mat. Sci. Eng. A, 362, 223–227 (2003).

    Article  Google Scholar 

  22. D. Zvivković, “Estimation of the dynamic viscosity for Ag–In and In–Sb liquid alloys using different models,” Zeitschrift für Metallkunde, 97, No.1, 89–93 (2006).

    Google Scholar 

  23. D.J. Steinberg, “A simple relationship between the temperature dependence of the density of liquid metals and their boiling temperatures,” Metall. Trans., 5, No. 6, 1341–1343 (1974).

    Article  CAS  Google Scholar 

  24. J. Brillo, I. Egry, and I. Ho, “Density and thermal expansion of liquid Ag–Cu and Ag–Au alloys,” Int. J. Thermoph., 27, No. 2, 494–506 (2006).

    Article  CAS  Google Scholar 

  25. C. Lüdecke and D. Lüdecke, Thermodynamik, Springer, Heidelberg (2000), p. 506.

  26. X.M. Zhong, K.C. Chou, Y. Gao, X. Guo, and X. Lan, “Estimating ternary dynamic viscosity in terms of Moelwyn-Hughes’ model,” Calphad., 25, No. 3, 455–460 (2001).

    Article  CAS  Google Scholar 

  27. A. Takeuchi, A. Inoue, T. Shindo, and Y. Waseda, “Enthalpies in alloys,” Mater. Trans. JIM, 41, No. 11, 1372–1378 (2000).

    Article  CAS  Google Scholar 

  28. I. Budai, M.Z. Benkő, and G. Kaptay, “Analysis of literature models on dynamic viscosity of binary liquid metallic alloys on the example of the Cu–Ag system,” Mater. Sci. Forum, 473, 309–314 (2005).

    Article  Google Scholar 

  29. G. Kaptay, “The exponential excess Gibbs energy model revisited,” Calphad, 56, 169–184 (2017).

    Article  CAS  Google Scholar 

  30. G. Kaptay, “On the interfacial energy of coherent interfaces,” Acta Mater., 60, No. 19, 6804–6813 (2012).

    Article  CAS  Google Scholar 

  31. A. Dinsdale, “SGTE data for pure elements,” Calphad, 15, No. 4, 317–425 (1991).

    Article  CAS  Google Scholar 

  32. I. Budai, M.Z. Benkő, and G. Kaptay, “Comparison of different theoretical models to experimental data on dynamic viscosity of binary liquid alloys,” Mater. Sci. Forum., 537, 489–496 (2007).

    Article  Google Scholar 

  33. S. Seetharaman and D. Sichen, “Estimation of the viscosities of binary metallic melts using Gibbs energies of mixing,” Metall. Mater. Trans. B, 25, No. 4, 589–595 (1994).

    Article  Google Scholar 

  34. G. Kaptay, “A unified equation for the dynamic viscosity of pure liquid metals,” Zeitschrift für Metallkunde, 96, No. 1, 24–31 (2005).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Miskolc, Hungary

    Dheeraj Varanasi & Manoj Kumar Pal

Authors
  1. Dheeraj Varanasi
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  2. Manoj Kumar Pal
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Correspondence to Dheeraj Varanasi.

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Published in Poroshkova Metallurgiya, Vol. 60, Nos. 7–8 (540), pp. 143–153, 2021.

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Varanasi, D., Pal, M.K. Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys. Powder Metall Met Ceram 60, 504–512 (2021). https://doi.org/10.1007/s11106-021-00262-w

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