Abstract
We study the interaction of thick films (~4 mm) of stearic acid (SA), a C18 alkane skeleton with an acid function, with late Ar–O2 post-discharge. Contrary to what is observed with thin films of SA (~2–3 μm) which are efficiently etched (part I), only functionalization is observed over the first 2 h of treatment with a plasma source operated in the continuous mode, whatever the temperature. The heat released by surface reactions affects non-linearly the temperature of the substrate. Pulsing the source at a frequency ranging from 0.1 to 1 kHz slows down the functionalization process but does not allow any etching of the material. On the contrary, the SA can be etched as thick films by pulsing the oxygen flow rate at a frequency below 50 mHz. By pulsing the reactive gas, the time averaged value of the [O]/[O2] ratio is decreased, limiting the functionalization processes due to oxygen atoms, and the mean temperature is lowered, decreasing the diffusion length of O2 (and/or possibly O2*) species in the SA which are responsible for the scission of C–C bonds of radicals.
Similar content being viewed by others
References
Rongzhi L, Lin Y, Yiu WM (1997) Compos Part A: Appl Sci Manuf 28A:73–86
Egitto FD, Matienzo LJ (1994) IBM J Res Dev 38:423–439
Stewart KR, Whiteshides GM, Godfried HP, Silvera IF (1986) Rev Sci Instrum 57:1381–1383
Chu PK, Chen JY, Wang LP, Huang N (2002) Mat Sci Eng R Rep R36:143–206
Risbud MV, Dabhade R, Gangal S, Bhonde RR (2002) J Biomater Sci Polym Ed 13:1067–1080
Hong J, Truica-Marasescu F, Martinu L, Wertheimer MR (2002) Plasmas Polym 7:245–260
Moreau S, Moisan M, Tabrizan M, Barbeau J, Pelletier J, Ricard A, Yahia L-H (2000) J Appl Phys 88:1166–1174
Philip N, Saoudi B, Crevier M-C, Moisan M, Barbeau J, Pelletier J (2002) IEEE Trans Plasma Sci 30:1429–1436
Ricard A, Moisan M, Moreau S (2001) J Phys D Appl Phys 34:1203–1212
Bracco P, Brach del Prever EM, Cannas M, Luda MP, Costa L (2006) Polym Degrad Stab 91:2030–2038
Premnath V, Harris WH, Jasty M, Merrill EW (1996) Biomoterials 17:1741–1753
Costa L, Luda MP, Trossarelli L, Brach del Prever EM, Crova M, Gallinaro P (1998) Biomaterials 19:659–668
Fozza AC, Bergeron A, Klemberg-Sapieha JE, Wertheimer MR (1999) “Plasma Deposition and Treatment of Polymers.” Symposium 109–14. Edited by Lee WW, d’Agostino R, Wertheimer MR
Fozza AC, Roch J, Klemberg-Sapieha JE, Kruse A, Holländer A, Wertheimer MR (1997) Nucl Instrum Methods Phys Res Sect B 131:205–210
Wertheimer MR, Fozza AC, Holländer A (1999) Nucl Instrum Methods Phys Res Sect B 151:65–75
Hody V, Belmonte T, Czerwiec T, Henrion G, Thiébaut JM (2006) Thin Solid Films 506–507:212–216
Hody V, Belmonte T, Pintassilgo C, Poncin-Epaillard F, Czerwiec T, Henrion G, Segui Y, Loureiro J (2006) Plasma Chem Plasma Proc 26:251–266
Belmonte T, Pintassilgo C, Czerwiec T, Henrion G, Hody V, Thiébaut JM, Loureiro J (2005) Surf Coat Technol 200:26–30
Mafra M, Belmonte T, Poncin-Epaillard F, da Silva Sobrinho AS, Maliska A (2008) Plasma Chem Plasma Proc 28:495–509
Mafra M, Belmonte T, Maliska A, da Silva Sobrinho AS, Cvelbar U, Poncin-Epaillard F (2008) Key Eng Mater 373–374:421–425
Murillo R, Poncin-Epaillard F, Segui Y (2007) Eur Phys J Appl Phys 37:299–305
SCA, USR–59, CNRS, Echangeur de Solaize, Chemin du Canal, 69360 Solaize, FRANCE. http://www.sca.cnrs.fr/
Dorai R, Kushner MJ (2003) J Phys D Appl Phys 36:666–685
Akishev Yu, Grushin M, Dyatko N, Kochetov I, Napartovich A, Trushkin N, Tran Minh Duc, Descours S (2008) J Phys D Appl Phys 41: 235203
Acknowledgments
The authors thank the CAPES/COFECUB, a joint Brazilian/French project (Ph 697/10), for support. These Researches were carried out within the framework of the Associated European Laboratory: «Laboratoire d’Interaction Plasma—Extrême Surface (LIPES)».
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Bernardelli, E.A., Belmonte, T., Duday, D. et al. Interaction Mechanisms Between Ar–O2 Post-Discharge and Stearic Acid II: Behaviour of Thick Films. Plasma Chem Plasma Process 31, 205–215 (2011). https://doi.org/10.1007/s11090-010-9264-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11090-010-9264-1