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Recycling Glass Fiber/Epoxy Resin of Waste Printed Circuit Boards: Morphology and Mechanical properties

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Mechanics of Composite Materials Aims and scope

Various composites were prepared from recycled waste printed circuit boards and an epoxy resin, and some of their mechanical properties (hardness, elongation at break, tensile and flexural strengths and moduli, and impact energy) were determined experimentally. The results obtained are presented in the form of diagrams.

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Acknowledgements

The authors thank the Office of the Higher Education Commission for funding this research project.

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Authors and Affiliations

  1. Department of Industrial Chemistry, Faculty of Applied Science, King Mongkut’s University of Technology North Bangkok, 1518 Pibulsongkram Road, Bangsue, Bangkok, 10800, Thailand

    R. Dangtungee & S. Somchua

  2. Research Center of Nano Industries and Biopolymer, Science and Technology Research Institute, King Mongkut’s University of Technology North Bangkok, 1518 Pibulsongkram Road, Bangsue, Bangkok, 10800, Thailand

    R. Dangtungee

  3. The Sirindhorn International Thai-German Graduate School of Engineering (TGGS), Production Engineering Department, King Mongkut’s University of Technology North Bangkok, 1518 Pibulsongkram Road, Bangsue, Bangkok, 10800, Thailand

    S. Siengchin

Authors
  1. R. Dangtungee
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  2. S. Somchua
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  3. S. Siengchin
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Corresponding authors

Correspondence to R. Dangtungee or S. Siengchin.

Additional information

Russian translation published in from Mekhanika Kompozitnykh Materialov, Vol. 48, No. 3, pp. 475-484 , May-June, 2012.

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Dangtungee, R., Somchua, S. & Siengchin, S. Recycling Glass Fiber/Epoxy Resin of Waste Printed Circuit Boards: Morphology and Mechanical properties. Mech Compos Mater 48, 325–330 (2012). https://doi.org/10.1007/s11029-012-9279-1

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  • DOI: https://doi.org/10.1007/s11029-012-9279-1

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