Abstract
Ce–Sn pre-alloy (master alloy) was designed for new lead-free solder alloy manufacturing. The microstructure characterization revealed the presence of CeSn3 particles in the Sn matrix. The melting behavior in air was investigated by differential thermal analysis coupled with thermogravimetric analysis. When melting was finished, the pre-alloy started to oxidize instantly, because of a high affinity between CeSn3 and Ce itself to oxygen. The oxidation process of Ce–Sn pre-alloy is described in detail. The solidus (231 °C) and liquidus (485 °C) temperatures of the alloy were determined by differential scanning calorimetry (DSC). By repetitive DSC measurement, it has been verified that this alloy had to be re-melted in an inert gas atmosphere to prevent oxidation. The master alloy is ultimately used to produce new Ce-containing Sn–Ag–Cu solder alloys.
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Acknowledgements
This work is the result of the project implementation: Centre of excellence for development and application of advanced diagnostic methods in processing of metallic and nonmetallic materials, ITMS:26220120048, supported by the Research and Development Operational Programme funded by the European regional development fund. The authors would also like to acknowledge the Project No. 1/0068/14 funded by the Grant Agency VEGA.
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Drienovsky, M., Trnkova, L.R., Ozvold, M. et al. Melting behavior and oxidation resistance of Ce–Sn alloy designed for lead-free solder manufacturing. J Therm Anal Calorim 125, 1009–1015 (2016). https://doi.org/10.1007/s10973-016-5482-y
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DOI: https://doi.org/10.1007/s10973-016-5482-y