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Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin

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Abstract

A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol−1, 9.4 s−1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents.

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Acknowledgements

This work was financially supported by Guangdong and Shenzhen Innovative Research Team Program (No. 2011D052, KYPT20121228160843692), National Natural Science Foundation of China (Grant No. 21201175), R&D Funds for basic Research Program of Shenzhen (Grant No. JCYJ20120615140007998), and the research funding from National S&T Major Project (No. 2011ZX02709).

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Authors and Affiliations

  1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China

    Jing Qin, Guoping Zhang & Rong Sun

  2. College of Materials Science and Engineering, Shenzhen University, Shenzhen, China

    Jing Qin

  3. Department of Electronic Engineering, Faculty of Engineering, The Chinese University of Hong Kong, Hong Kong, China

    Chingping Wong

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  1. Jing Qin
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  2. Guoping Zhang
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Correspondence to Guoping Zhang.

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Qin, J., Zhang, G., Sun, R. et al. Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin. J Therm Anal Calorim 117, 831–843 (2014). https://doi.org/10.1007/s10973-014-3807-2

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