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Methods and strategies to decrease the dielectric properties of polyimide films: a review

  • Review Paper: Functional coatings, thin films and membranes (including deposition techniques)
  • Published:
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Abstract

Polyimide films with low dielectric properties and high thermal stability have been widely used in advanced integrate circuit industry. Herein, this article briefly summarized the recent achievements in reducing the dielectric properties of polyimide films via a variety of methods or strategies, and the mechanical properties, thermal stability or optical properties were also summarized. Achieving the synergy of low dielectric properties, high thermal stability and superior mechanical properties is the research directions and priories of future development for polyimide films.

Graphical Abstract

Highlights

  • Reducing the molecular polarizability and enhancing the fractional free volume are the main strategies to decrease k of PI films.

  • Introducing porous structures is the most efficient approach to decrease the k of PI films.

  • Achieving the synergy of low k, high thermal stability and superior mechanical properties are the research priories for PI films.

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Abbreviations

PI:

Polyimide

PAA:

Polyamide acid

k:

Dielectric constant

DF:

Dielectric loss

TG:

Glass transition temperature

FFV:

Fractional free volume

T450:

Transmittance at 450 nm

CET:

Coefficient of linear thermal expansion

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Acknowledgements

This research was financially supported by the National Natural Science Foundation of China (Project No. 52202079), Shenzhen Science and Technology Innovation Committee (JSGGZD20220822095400002, JCYJ20200109141808025, JSGG20210629144802007) and Post-doctoral Later-stage Foundation Project of Shenzhen Polytechnic (6023271013K，6021271003K), and the Start-up Scientific Research Foundation Project of Shenzhen Polytechnic (6023312048K).

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  1. Institute of Critical Materials for Integrated Circuits, Shenzhen Polytechnic, Shenzhen, 518000, China

    Dongyang Zhang, Linling Li, Yong Wang, Chen Zhang & Chao Teng

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Zhang, D., Li, L., Wang, Y. et al. Methods and strategies to decrease the dielectric properties of polyimide films: a review. J Sol-Gel Sci Technol 108, 1–12 (2023). https://doi.org/10.1007/s10971-023-06143-5

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  • DOI: https://doi.org/10.1007/s10971-023-06143-5

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