Abstract
Copper is one of few elements that have no long-lived radioisotopes and which can be electrodeposited to ultra-high levels of purity. Experiments probing neutrino properties and searching for direct evidence of dark matter require ultra-clean copper, containing the smallest possible quantities of radioactive contaminants. Important to the production of such copper is establishing the location and dispersion of contamination within the bulk material. Co-deposition of contaminants during copper electrodeposition and its relationship to nucleation and growth processes were investigated using scanning electron microscopy (SEM), laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS), and secondary ionization mass spectrometry (SIMS).
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Acknowledgements
The authors would like to acknowledge the NNSA Office of Research and Engineering (NA-22) for their support of this work and Chuck Windisch for his technical assistance. Pacific Northwest National Laboratory is managed by Battelle Memorial Institute under contract DE-AC05-76RLO1830.
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Hoppe, E.W., Mintzer, E.E., Aalseth, C.E. et al. Microscopic evaluation of contaminants in ultra-high purity copper. J Radioanal Nucl Chem 282, 315 (2009). https://doi.org/10.1007/s10967-009-0241-1
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DOI: https://doi.org/10.1007/s10967-009-0241-1