Abstract
Thermal nondestructive evaluation has shown promise as a potential NDE technology for next generation US Army rotorcraft structures because it is rapid, noncontacting, and able to inspect complex geometries. To successfully apply thermal inspection systems for field use, the cost and size must be lowered. The infrared camera is a major factor contributing to the overall cost of commercially available thermal inspection systems. Recent advances in uncooled microbolometer focal plane array detectors have resulted in low cost, small size/weight, and low power consumption cameras. These attributes make this technology well suited for portable low cost thermal inspection systems. The purpose of this paper is to investigate the capabilities of the new microbolometer infrared cameras for quantitative thermal nondestructive evaluation. Quantitative thermal diffusivity and thickness images are obtained by minimizing the squared difference between the data and a thermal model on samples with fabricated defects. Critical infrared camera features such as spatial and temperature resolution, detector response time, and detector stability are studied by comparing results to a conventional thermal imaging camera using a cooled InSb focal plane array detector. Finally several techniques are presented to improve the camera’s performance. These techniques include temporal background subtraction, use of a synchronized electronic shutter system, and cyclic flash heating.
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References
L. Adams, “NASA warms to thermal tests,” Quality Magazine, NDT Section, pp. 6–8 (February 2004).
R. F. Anastasi, J. N. Zalameda, and E. I. Madaras, “Damage detection in rotorcraft composite structures using thermography and laser-based ultrasound, SEM X International Congress and Exposition on Experimental and Applied Mechanics,” (June 2004).
R. A. Wood, “Uncooled thermal imaging with monolithic silicon focal planes,” Proceedings of SPIE, Infrared Technology XIX, pp. 329–336 (2002).
W. P. Winfree and D. M. Heath, “Thermal diffusivity imaging of aerospace materials and structures,” Proceedings of SPIE, Thermosense, XXIII 3361, pp. 282–290 (1998).
P. Cielo, X. Maldague, A. Deom, and R. Lewark, “Thermographic nondestructive evaluation of industrial materials and structures.” Mater. Eval. 45, pp. 452–460 (1987).
S. Ahuja, W. A. Ellingson, J. Stukey, and E. R. Koehl, “Determining thermal diffusivity and defects attributes in ceramic matrix composites by infrared imaging,” Thermosense XVIII, SPIE 2766, pp. 249–257.
J. N. Zalameda, W. P. Winfree, D. M. Heath, and J. A. Thornhill, “Heat source characterization for quantitative thermal nondestructive evaluation,” in Review of Progress in Quantitative NDE, edited by D. O. Thompson and D. E. Chimenti, Vol. 18A, pp. 585–592 (1999) Plenum Press, New York.
W. R. Press, B. P. Flannery, S. A. Teukolsky, and W. T. Vetterling, Numerical Recipies: The Art of Scientific Computing, 1986, Cambridge University Press.
Indigo Systems Inc., Alpha Uncooled Microbolometer Camera User’s Guide, 412-0003-10, Version 1.0.
J. N. Zalameda, “Synchronized electronic shutter system (SESS) for thermal nondestructive evaluation,” Thermosense XXIII, Proceedings of SPIE 4360, pp. 616–623 (2001).
W. P. Winfree and J. N. Zalameda, “Single sided thermal diffusivity imaging with a shuttered thermographic inspection system,” in Review of Progress in Quantitative NDE, edited by D. O. Thompson and D. E. Chimenti, 2001, Plenum Press, New York.
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Zalameda, J.N., Winfree, W.P. Investigation of Uncooled Microbolometer Focal Plane Array Infrared Camera for Quantitative Thermography. J Nondestruct Eval 24, 1–9 (2005). https://doi.org/10.1007/s10921-005-6656-x
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DOI: https://doi.org/10.1007/s10921-005-6656-x