Abstract
Hexagonal boron nitride nanosheets (BNNS) and their photosensitive resin-based composites have excellent thermal conductivity, thermal stability, and electrical properties, making them promising applications in electronic devices and packaging. In this paper, BNNS were exfoliated by hydrothermal method, and BNNS/photosensitive resin composite was prepared by ultraviolet curing. The enhancement effect of BNNS on the thermal stability and electrical properties of the composites was studied. The result showed that few-layer BNNS with hexagonal structure were obtained after hydrothermal exfoliation of hexagonal boron nitride (h-BN), part of the B–N bond in BNNS formed a covalent bond with the photosensitive resin matrix. Both of chemical interface and overlapping interface formed between BNNS and the matrix help to form a better and tighter interface, which effectively improves the thermal stability of the photosensitive resin. As the mass percentage of BNNS increases, the temperature required for the decomposition of BNNS/photosensitive resin composites increases, and the relative permittivity also increases significantly because of the interface polarization. When the content of BNNS reaches 10 wt%, it reaches the highest value of 7.623 at the frequency of 1 kHz. Due to the high surface area of the few-layer BNNS, a network structure is formed in the matrix, which improves the breakdown strength of the photosensitive resin.
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This work was supported by the National Natural Science Foundation of China (No. 52175464).
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All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by KL, WZ, ID and MS. The manuscript was written by CC and AW, and all authors have taken full responsibility for the content of this manuscript.
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Chen, C., Shao, M., Liu, K. et al. Enhanced Thermal and Electrical Properties of Photosensitive Resin Matrix Composites with Hexagonal Boron Nitride Nanosheets. J Inorg Organomet Polym 33, 319–327 (2023). https://doi.org/10.1007/s10904-022-02500-z
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DOI: https://doi.org/10.1007/s10904-022-02500-z