Abstract
High thermal conductivity polymer composites have increased application in modern electronics. To achieve high thermal conductivity at relatively low filler content, two critical approach are used: surface modification of the filler and construction of thermal conductive network in polymer composites. This article provided a new simple and feasible method to modify h-BN consisting of physical absorption of polyvinylpyrrolidone (PVP) and hydrolysis of tetraethyl orthosilicate (TEOS). Then, SiO2@BN/PMMA composites were fabricated via solution-mixing and hot compression. The surface modification of BN enhanced the interface interaction between adjacent BN, which led to reduced thermal resistance and phonon scattering. The solution-mixing and hot compression process ensured the formation of thermal conductive pathway at the same time. The highest thermal conductivity of 40 vol% SiO2@BN/PMMA composite reached 5.583W /m K, which exhibited 3292% and 200% enhancement compared with the pure PMMA and melt-mixing BN/PMMA composites, respectively.
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The author would like to acknowledge the financial support from National Key R&D Program of China (No. 2017YFB0406200) and Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences (KFJ-STS-ZDTP-069).
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Tang, Y., Xiao, C., Ding, J. et al. Synergetic enhancement of thermal conductivity in the silica-coated boron nitride (SiO2@BN)/polymethyl methacrylate (PMMA) composites. Colloid Polym Sci 298, 385–393 (2020). https://doi.org/10.1007/s00396-020-04617-4
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DOI: https://doi.org/10.1007/s00396-020-04617-4