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Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

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Abstract

Cu sintering has attracted considerable attention because of its low electrical resistance, high thermal conductivity, low resistance to ion migration, and reasonable price. But, the unique oxidation tendency of Cu is the leading cause of hindering Cu sintering. Several methods have been proposed to solve this oxidation problem. In this study, Cu paste for die attachment was prepared by selecting appropriate solvents, activators, and additives. The sintering properties and bonding strength of Cu paste were governed by the molecular weight and the chain length of the solvent. Among various solvents, the highest shear strength was observed in the case of polyethylene glycol (PEG) solvent. The addition of dicarboxylic acid allowed for a faster reduction rate of copper oxide, which improved Cu sintering performance. A Cu binder with a stable reduction reaction and storage stability was developed by applying a phenol-based antioxidant.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

This work was supported by research funds from the Korea Institute of Industrial Technology (KITECH) (No. 20018145).

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Authors and Affiliations

  1. Micro-Joining Center, Korea Institute of Industrial Technology, 156 Gaetbeol-ro, Yeonsu-gu, Incheon, 406-840, Korea

    Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, Shin-Il Kim & JungHwan Bang

  2. Department of Material Science and Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul, 136-713, Korea

    Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, Shin-Il Kim & Dongjin Byun

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  1. Junhyuk Son
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  2. Dong-Yurl Yu
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  3. Yun-Chan Kim
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  4. Shin-Il Kim
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  5. Dongjin Byun
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  6. JungHwan Bang
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Contributions

All authors contributed to this work. The conception and design of the project were performed by JB. Material preparation, data collection, and analysis were performed by JS, DYY, YCK, SIK, and DB. The first draft of the manuscript was written by JS, and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to JungHwan Bang.

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Son, J., Yu, DY., Kim, YC. et al. Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach. J Mater Sci: Mater Electron 34, 1459 (2023). https://doi.org/10.1007/s10854-023-10833-9

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  • DOI: https://doi.org/10.1007/s10854-023-10833-9

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