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Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes

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Abstract

The interfacial microstructure and brittle fracture reliability of solder joints on direct electroless gold (DEG) and electroless palladium immersion gold (EPIG), which are novel surface finishes for high-frequency package substrates, were evaluated in this study. A Cu6Sn5 intermetallic compound (IMC) was formed at the interface of Sn-3.0Ag-0.5Cu (SAC305)/DEG or SAC305/EPIG, while (Cu,Ni)6Sn5 and Ni3P were formed at the interface of SAC305/ENEPIG. After 1000 h of thermal aging, the IMC thickness of the SAC305/DEG and SAC305/EPIG samples increased by 217% and by 181%, respectively, while that of SAC305/ENEPIG increased by only 51%. Although ENEPIG had the lowest IMC thickness, its brittleness was higher than that of DEG and EPIG because of the different fracture paths. Fractures occurred between Cu6Sn5/Cu pad and Cu6Sn5/Cu3Sn interface for SAC305/DEG and SAC305/EPIG, while fractures mainly occurred in the Ni3P layer of SAC305/ENEPIG.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author upon reasonable request.

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Funding

This work was supported by research funds from the Korea Institute of Industrial Technology (KITECH) (No. EO220005).

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Authors and Affiliations

  1. Advanced Joining & Manufacturing R&D Department, Korea Institute of Industrial Technology, Incheon, 21999, South Korea

    Tae-Young Lee, Jungsoo Kim, So-Yeon Jun, Byeong-Jin Ahn & Sehoon Yoo

  2. Department of Materials Science & Engineering, Hanyang University, Seoul, 04763, South Korea

    Tae-Young Lee

  3. MK Chem & Tech Co., Ltd, Ansan, 15434, South Korea

    Deok-Gon Han

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  1. Tae-Young Lee
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Contributions

All authors contributed to this work. The conception and design of the project were performed by SY. Material preparation, data collection, and analysis were performed by T-YL, JK, S-YJ, B-JA, and D-GH. The first draft of the manuscript was written by T-YL, and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Sehoon Yoo.

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Lee, TY., Kim, J., Jun, SY. et al. Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes. J Mater Sci: Mater Electron 34, 129 (2023). https://doi.org/10.1007/s10854-022-09510-0

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