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Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb

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Abstract

To further improve the performance of the Sn–3.5Ag–0.5Cu solder, trace amount of rare earth Tb was added. The wettability, shear strength and interface compounds (IMCs) were investigated in this work. The finding indicated that the addition of the Tb element in the Sn–Ag–Cu solder could delay the formation of IMCs during soldering, and the thinner IMC layers were obtained. The maximum shear strength can be found with 0.025 wt% Tb addition, and the wettability of the solder could be somewhat improved. Moreover, the addition of 0.025 wt% Tb could slow down the growth of IMC during aging, which was of great significance to extend the reliability of the joint interface and the service life of the solder joint. This work has provided a theoretical basis for the development and application.

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Data availability

The data that support the findings of this study are available on request from the corresponding author.

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Acknowledgements

Thanks are given to Mr. Guoyang Li for his help during sample preparation.

Funding

This work was supported by the Science and Technology Research Project of Education Agency of Jiangxi Province (Grant No. GJJ190479), Innovation and Entrepreneurship Training Grant Program for College Students of Jiangxi University of Science and Technology (Grant No. 202110407007).

Author information

Authors and Affiliations

  1. College of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou, 341000, Jiangxi, People’s Republic of China

    Zeyu Yuan, Yujie He, Ruize Wu, Ming Xu, Jun Zhang, Yunqing Zhu, Weibin Xie & Huiming Chen

  2. Faculty of Science, Jiangxi University of Science and Technology, Ganzhou, 341000, Jiangxi, People’s Republic of China

    Qiaoli Wang

  3. Advanced Copper Industry Institute, Jiangxi University of Science and Technology, Yingtan, 335000, Jiangxi, People’s Republic of China

    Weibin Xie & Huiming Chen

  4. National Rare Earth Functional Materials Innovation Center, Jiangxi University of Science and Technology, Ganzhou, 341000, Jiangxi, People’s Republic of China

    Huiming Chen

Authors
  1. Zeyu Yuan
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  2. Yujie He
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  3. Ruize Wu
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  4. Ming Xu
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  5. Jun Zhang
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  7. Qiaoli Wang
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  8. Weibin Xie
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  9. Huiming Chen
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Contributions

ZYY: Experimental, visualization and validation. YJH: Investigation process. RZW: Conducting research. MX: Visualization and validation. JZ: Experimental. YQZ: Experimental ideas and scheme design. QLW: Writing and editing. WBX: Data curation and supervision. HMC: Resources, supervision, and project administration.

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Correspondence to Qiaoli Wang or Huiming Chen.

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Yuan, Z., He, Y., Wu, R. et al. Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb. J Mater Sci: Mater Electron 33, 20769–20777 (2022). https://doi.org/10.1007/s10854-022-08886-3

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  • DOI: https://doi.org/10.1007/s10854-022-08886-3

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