Skip to main content
SpringerLink
Log in

Heat-resistant and electrical properties of bismaleimide modified epoxy resin

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The ever-increasing development of power modules requires epoxy (EP) encapsulants to have excellent heat-resistance capability. Many studies have been conducted on improving the heat-resistance of epoxy encapsulants and have made important achievements in recent years. However, the electrical insulation of the EP-based high heat-resistance materials has not been paid enough attention and less studied. In this paper, BMI/EP systems have been prepared, and the electrical characteristics and heat-resistance of the modified BMI/EP have been investigated. Dynamic thermomechanical analysis shows the introduction of BMI greatly improves the heat-resistance of the epoxy systems. The electrical conductivity and breakdown characteristics of BMI/EP samples were measured at 30, 50, and 70 °C, respectively. The analysis of space charge indicates the trap distribution in the 10%BMI can significantly suppress carrier migration, resulting in the highest electric breakdown strength and the lowest current density. The excellent insulation properties with improved heat-resistance demonstrate that BMI/EP has great potential to be used in power modules.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

References

  1. H. Lee, V. Smet, R. Tummala, IEEE J. Emerg. Sel. Top. Power Electron. 8, 1 (2020)

    Article  Google Scholar 

  2. S. Kikuchi, S. Mizutani, H. Miyake, Y. Tanaka, Traub 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications (IEEE, USA, 2014), pp. 808–811

  3. Z. Liang, P. Ning, F. Wang, IEEE Trans. Power Electron. 29, 5 (2014)

    Google Scholar 

  4. M. Chen, H. Wang, D. Pan, X. Wang, F. Blaabjerg, IEEE J. Emerg. Sel. Top. Power Electron. 9, 4 (2021)

    Google Scholar 

  5. Y. Yao, Z. Chen, G. Lu, D. Boroyevich, K.D.T. Ngo, IEEE Trans. Compon. Pack. Manuf. Technol. 2, 4 (2012)

    Article  Google Scholar 

  6. Y. Yao, G. Lu, D. Boroyevich, K.D.T. Ngo, IEEE Trans. Compon. Pack. Manuf. Technol. 5, 2 (2015)

    Article  Google Scholar 

  7. J. Ren, Q. Li, L. Yan, L. Jia, X. Huang, L. Zhao, Q. Ran, M. Fu, Mater Des. 191, 108663 (2020)

    Article  CAS  Google Scholar 

  8. L. Zhao, L. Yan, C. Wei, Q. Li, X. Huang, Z. Wang, M. Fu, J. Ren, J. Phys. Chem. C 124, 23 (2020)

    Google Scholar 

  9. K. Yang, W. Chen, Y. Zhao, Y. He, X. Chen, B. Du, W. Yang, S. Zhang, Y. Fu, ACS Appl. Mater. Interfaces 13, 22 (2021)

    Google Scholar 

  10. J.F. Fagnard, S. Stoukatch, P. Laurent, F. Dupont, C. Wolfs, S.D. Lambert, J.M. Redouté, IEEE Trans. Compon. Pack. Manuf. Technol. 11, 4 (2021)

    Article  Google Scholar 

  11. J. Chen, V. Liu, L. Lin, M. Chung, C.L. Gan, H. Takiar, International Conference on Electronics Packaging (ICEP), (IEEE, Japan, 2021), pp 131–132

  12. J. Liu, S. Wang, Y. Peng, J. Zhu, W. Zhao, X. Liu, Prog Polym. Sci. 113, 5 (2021)

    Article  Google Scholar 

  13. H. Kimura, K. Ohtsuka, M. Yonekawa, Polym. Adv. Technol. 32, 2 (2021)

    Article  Google Scholar 

  14. R.K. Jena, C.Y. Yue, M.M. Sk, K. Ghosh, RSC Adv. 5, 97 (2015)

    Article  Google Scholar 

  15. R. Li, D. Yang, P. Zhang, F. Niu, M. Cai, G.Q. Zhang, J. Electron. Packag 143, 1 (2020)

    CAS  Google Scholar 

  16. X. Zhu, Y. Yin, S. Peng, J. Wu, W. Li, X. Chen, Z. Li, J. Guan, High. Volt 6, 5 (2021)

    Google Scholar 

  17. Q.-K. Feng, S.-L. Zhong, J.-Y. Pei, Y. Zhao, D.-L. Zhang, D.-F. Liu, Y.-X. Zhang, Z.-M. Dang, Chem. Rev. 122, 3 (2022)

    Article  Google Scholar 

  18. X. Chen, C. Dai, Z. Hong, M. Awais, A. Paramane, Y. Tanaka, J. Appl. Polym. Sci. 138, 28 (2021)

    Google Scholar 

  19. Y. Hang, D. Boxue, Y. Wei, K. Xiaoxiao, L. Jin, R. Zhaoyu, Y. Tanaka, IEEE 3rd International Conference on Dielectrics (ICD), (IEEE, Spain, 2020), pp 237–240

  20. Y. Wang, J. Wu, Y. Yin, IEEE Trans. Dielectr. Electr. Insul. 26, 3 (2019)

    Article  Google Scholar 

  21. X. Pang, P. Liu, Z. Peng, B. Cui, X. Yang, Y. Wen, IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), (IEEE, Malaysia, 2021), pp 155–158

  22. C. Dai, X. Chen, Q. Wang, M. Awais, G. Zhu, Y. Shi, A. Paramane, Y. Tanaka, Nanotechnology. 32, 31 (2021)

    Google Scholar 

  23. J. Naveen, M.S. Babu, R. Sarathi, J. Polym. Res. 28, 10 (2021)

    Article  Google Scholar 

  24. S. Kikuchi, S. Mizutani, H. Miyake, Y. Tanaka, IEEE Conference on Electrical Insulation and D. Phenomena (CEIDP) (IEEE, USA, 2014), pp 808–811

Download references

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. U20A20308, 51977050, 52007042), Natural Science Foundation of Heilongjiang Province (No. TD2019E002), China Postdoctoral Science Foundation (Nos. 2021T140166, 2018M640303), Youth Innovative Talents Training Plan of Ordinary Undergraduate Colleges in Heilongjiang (Nos. UNPYSCT-2020178, UNPYSCT-2020180). Tiandong Zhang acknowledges the support from the China Scholarship Council (CSC).

Author information

Authors and Affiliations

  1. Key Laboratory of Engineering Dielectric and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin, 150080, People’s Republic of China

    Qingguo Chi, Xiaowen Zhang, Changhai Zhang, Yu Feng, Chao Tang, Zhonghua Li & Tiandong Zhang

  2. School of Electrical & Electronic Engineering, Harbin University of Science and Technology, Harbin, 150080, People’s Republic of China

    Qingguo Chi, Xiaowen Zhang, Changhai Zhang, Yu Feng, Chao Tang, Zhonghua Li & Tiandong Zhang

Authors
  1. Qingguo Chi
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaowen Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Changhai Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yu Feng
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Chao Tang
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Zhonghua Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Tiandong Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

All authors contributed to the study conceptualization, methodology, preparation, investigation, data analysis, writing of original draft, reviewing, and editing.

Corresponding authors

Correspondence to Changhai Zhang or Tiandong Zhang.

Ethics declarations

Conflict of interest

There are no conflicts to declare.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Chi, Q., Zhang, X., Zhang, C. et al. Heat-resistant and electrical properties of bismaleimide modified epoxy resin. J Mater Sci: Mater Electron 33, 17868–17876 (2022). https://doi.org/10.1007/s10854-022-08650-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-022-08650-7

Search

Navigation