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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

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Abstract

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1 wt%) were successfully synthesized through the powder metallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finish material, the SAC-xCNT/ENIAg exhibited IMC thickness values within the range of 2.98–2.65 µm as compared to the 5.23–3.61 µm demonstrated by the SAC-xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibiting the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively.

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Data availability

The datasets generated during and/or analysed during the current study are available from the corresponding author on reasonable request.

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Acknowledgements

The authors would like to acknowledge the Ministry of Higher Education Malaysia (KPT) and Universiti Putra Malaysia (UPM) for providing necessary resources in completing this study. This research was fully funded by the Universiti Putra Malaysia (UPM) Research Grant (UPM-GRANT Putra, UPM/GP-IPB/2020/9688700), and the Ministry of Higher Education Malaysia (KPT) Research Grant (FRGS/2012/5524194).

Funding

This research was fully funded by the Universiti Putra Malaysia (UPM) Research Grant (UPM-GRANT Putra, UPM/GP-IPB/2020/9688700), and the Ministry of Higher Education Malaysia (KPT) Research Grant (FRGS/2012/5524194).

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Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia (UPM), 43400, Serdang, Selangor, Malaysia

    T. T. Dele-Afolabi, M. A. Azmah Hanim & K. Vidyatharran

  2. Department of Mechanical Engineering, Faculty of Engineering, Ajayi Crowther University, P.M.B. 1066, Oyo, Oyo State, Nigeria

    T. T. Dele-Afolabi

  3. Advance Engineering Materials and Composites Research Center, (AEMC), Faculty of Engineering, Universiti Putra Malaysia (UPM), 43400, Serdang, Selangor, Malaysia

    M. A. Azmah Hanim

  4. Department of Physics, Faculty of Science, Universiti Putra Malaysia (UPM), 43400, Serdang, Selangor, Malaysia

    K. A. Matori

  5. Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, 86400, Batu Pahat, Johor, Malaysia

    O. Saliza Azlina

  6. Department of Metallurgy and Materials Engineering, Faculty of Engineering, Kirikkale University, Kirikkale, Turkey

    R. Calin

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  1. T. T. Dele-Afolabi
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by [KV], [AHMA] and [TTDA]. The first draft of the manuscript was written by [TTDA] and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Dele-Afolabi, T.T., Hanim, M.A.A., Vidyatharran, K. et al. Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. J Mater Sci: Mater Electron 33, 8233–8246 (2022). https://doi.org/10.1007/s10854-022-07974-8

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