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Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures

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Abstract

For the reliability of cryoelectronics, the tensile performance and fracture behavior of microscale Cu/Sn3.0Ag0.5Cu/Cu joints with shrinking size were investigated at decreasing temperature ranging from 25 °C to −120 °C. The experimental results showed that the tensile behavior of solder joints was greatly influenced by temperature and joint size. The tensile strength of the solder joint increased with decreasing temperature. At a same temperature, the joint tensile strength increased with decreasing thickness-to-diameter ratio (R = t/d, 1, 1/2 and 1/4). In addition, at a same R, the joint with a smaller diameter had a higher tensile strength. In general, the tensile strength showed an inversely proportional function of solder volume. Moreover, as temperature decreased, the fracture position changed from the solder matrix to the interface between solder and intermetallic compound layer, showing a ductile-to-brittle transition. The ductile-to-brittle transition temperature increased with decreasing R in the solder joints with a same diameter, and it decreased with decreasing joint diameter in the solder joints with a same R.

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Data availability

The data and materials that support the findings of this study are available from the corresponding author upon reasonable request.

Code availability

The codes are not publicly available as they also form part of an ongoing study.

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Funding

This research was funded by the National Natural Science Foundation of China under Grant Nos. 51805103 and 52065015, Natural Science Foundation of Guangxi Province under Grant Nos. 2018GXNSFBA281065 and 2018GXNSFAA281222, Science and Technology Planning Project of Guangxi under Grant No. GuiKeAD18281021, Director Fund Project of Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology No. 19-050-44-003Z, Self-Topic Fund of Engineering Research Center of Electronic Information Materials and Devices No. EIMD-AB202005, and Innovation Project of Guangxi Graduate Education Nos. YCSW2021184 and JGY2021084.

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, 541004, China

    Jun Gui, Xingmin Li, Jian Wang, Wangyun Li & Hongbo Qin

  2. Engineering Research Center of Electronic Information Materials and Devices, Ministry of Education, Guilin University of Electronic Technology, Guilin, 541004, China

    Wangyun Li

Authors
  1. Jun Gui
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  2. Xingmin Li
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  3. Jian Wang
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  4. Wangyun Li
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  5. Hongbo Qin
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Contributions

JG: Methodology, Formal analysis, Data curation, and Writing—original draft. XL: Formal analysis, Methodology, and Data curation. JW: Methodology, Formal analysis, and Data curation. WL: Conceptualization, Methodology, Formal analysis, Data curation, and Writing—original draft. HQ: Conceptualization, Methodology, and Writing—review & editing.

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Correspondence to Wangyun Li or Hongbo Qin.

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Gui, J., Li, X., Wang, J. et al. Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures. J Mater Sci: Mater Electron 32, 28454–28467 (2021). https://doi.org/10.1007/s10854-021-07226-1

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  • DOI: https://doi.org/10.1007/s10854-021-07226-1

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