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Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications

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Abstract

Silver powders were prepared by a chemical reduction method. Effects of different surfactants during this preparation process were examined. Using these silver powders, silver pastes were prepared for low temperature co-fired ceramics (LTCC) applications. Another batch of different surfactants were added into the silver paste and evaluated. Moreover, various organic thixotropic agents were used to modify the thixotropy behavior of the silver paste. It was found that the surfactants of PVP (Polyvinyl pyrrolidone, for preparation of the silver powder) and Span-85 (for the preparation of silver paste) exhibited the best performance, with an electrical resistivity of 0.11 mΩ mm. The silver paste with the thixotropic agent of hydrogenated castor oil shows the largest thixotropic index of 1.56. Using different organic additives, the microstructural, rheological and electrical properties of the silver paste can be considerably improved, and our results shed light on the optimization of the silver paste for LTCC applications.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant No. 51772054).

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Authors and Affiliations

  1. School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China

    Yongcai Hu, Yingbang Yao, Yue Ma, Yi Li, Yiwen Xu, Xiaobo Zhao, Tao Tao, Bo Liang & Shengguo Lu

  2. Dongguan South China Design Innovation Institute Building D-1, University Innovation City Area, Songshan Lake, Dongguan, 523808, China

    Yongcai Hu, Yingbang Yao, Yi Li, Yiwen Xu, Xiaobo Zhao, Tao Tao, Bo Liang & Shengguo Lu

  3. Beijing Institute of Radio Measurement, No. 50 Yongding Road, Haidian District, Beijing, 100854, China

    Zhaofu Du

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  1. Yongcai Hu
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Hu, Y., Du, Z., Yao, Y. et al. Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications. J Mater Sci: Mater Electron 32, 14368–14384 (2021). https://doi.org/10.1007/s10854-021-05999-z

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