Abstract
A redistributed polyphenylene oxide (rPPO) was synthesized and used to modify cyanate resin (CE) to give cured rPPO/CE mixed resin systems, whose molecular weight and chemical composition were analyzed by Gel Permeation Chromatography (GPC) and Fourier Transform Infrared Spectroscopy (FT-IR). The mechanical, thermal conductivity and dielectric properties of these mixed resin systems were measured, with the rPPO containing 20 wt% bisphenol A (BPA) having a number-average molecular weight as low as 2653. The glass transition temperature (Tg) of cured rPPO/CE mixed resin systems was decreased significantly (lowest value − 230 °C) when compared with pure cured cyanate resin containing 1 wt% epoxy resin. The bending strength of cured resin was decreased when low molecular weight PPO (lowest value − 46.84 MPa) was employed as a substrate. These new cured rPPO/CE mixed resin systems exhibited a low dielectric constant of 3.85/107 Hz, a low dielectric loss of 2.64 × 10−3/106 Hz, and a low thermal diffusivity of 0.143 m2/s, that indicates they may be useful for the preparation of CCLs for electronics applications.
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Acknowledgements
This research was supported by the National Natural Science Foundation of China (No. 51677045, 51177030) a, the Harbin science and Technology Innovation Talents Project (No. 2016RAQXJ059), the Fundamental Research Funds For the Central Universityies(HEUCFP201731 and HEUCFP201719).
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Weng, L., Zhang, Y., Zhang, X. et al. Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates. J Mater Sci: Mater Electron 29, 2831–2840 (2018). https://doi.org/10.1007/s10854-017-8212-8
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DOI: https://doi.org/10.1007/s10854-017-8212-8