Skip to main content
SpringerLink
Log in

The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The interfacial reaction, morphology, activation energies and growth behavior of interfacial intermetallic compounds (IMCs) between the Sn–3Ag–0.5Cu (in wt%) solder and Cu substrate during reflow at 280 °C for 10 min and aging at different temperatures for up to 360 h were investigated, and the growth kinetics of the interfacial Cu–Sn binary IMC layers were monitored during the isothermal aging. The results showed that the thickness of IMCs increased linearly with square root of aging time, and the diffusion coefficient related to the Cu–Sn IMC layer increased with increasing aging temperature. During aging at medium temperature (180 °C), the scallop-like Cu6Sn5 IMC layer at the SAC305/Cu interface gradually transformed into planar type with prolonged aging time. Nevertheless, in the case of high temperature (200 °C) aging, the solder/Cu6Sn5 interface became uneven because the Cu atoms came from the bulk solder would accumulate on the Cu6Sn5 IMC surface to directly thicken the existed IMC layer. Beside, the Kirkendall voids within Cu3Sn layer and the neighborhood of the Cu3Sn/Cu interface almost aggregated into continuous regions to formed micro-voids. The activation energies of the total Cu–Sn, Cu6Sn5 and Cu3Sn IMCs were obtained by plotting the diffusion constants (D) as a function of the aging temperature (1/T), and were 115.2, 122 and 98 kJ/mol, respectively.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14

Similar content being viewed by others

References

  1. T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao, Low temperature bonding for high temperature applications by using SnBi solders. J. Alloys Compd. 647(25), 681–685 (2015)

    Article  CAS  Google Scholar 

  2. C. Key Chung, Y.J. Chen, C.C. Li, C.R. Kao, The critical oxide thickness for Pb-free reflow soldering on Cu substrate. Thin Solid Films 520(16), 5346–5352 (2012)

    Article  CAS  Google Scholar 

  3. Y.W. Wang, Y.W. Lin, C.R. Kao, Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectron. Reliab. 49(3), 248–252 (2009)

    Article  CAS  Google Scholar 

  4. M.Y. Tsai, S.C. Yang, Y.W. Wang, C.R. Kao, Grain growth sequence of CuSn in the Cu/Sn and Cu/Sn–Zn systems. J. Alloys Compd. 494(1), 123–127 (2010)

    Article  CAS  Google Scholar 

  5. Y.W. Wang, Y.W. Lin, C.T. Tu, C.R. Kao, Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu. J. Alloys Compd. 478(1), 121–127 (2009)

    Article  CAS  Google Scholar 

  6. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, C.R. Kao, Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations. Mater. Sci. Eng. 396(1), 385–391 (2005)

    Article  CAS  Google Scholar 

  7. S.C. Yang, C.C. Chang, M.H. Tsai, C.R. Kao, Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni. J. Alloys Compd. 499(2), 149–153 (2010)

    Article  CAS  Google Scholar 

  8. H.W. Yang, J.Y. Wu, Z.X. Zhu, C.R. Kao, Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints. Mater. Chem. Phys. 191, 13–19 (2017)

    Article  CAS  Google Scholar 

  9. Y.W. Wang, Y.W. Lin, C.R. Kao, Inhibiting the formation of microvoids in CuSn by additions of Cu to solders. J. Alloys Compd. 493(1), 233–239 (2010)

    Article  CAS  Google Scholar 

  10. F. Wang, L. Zhou, X. Wang et al., Microstructural evolution and joint strength of Sn–58Bi/Cu joints through minor Zn alloying substrate during isothermal aging. J. Alloys Compd. 688, 639–648 (2016)

    Article  CAS  Google Scholar 

  11. X. Hu, T. Xu, L.M. Keer et al., Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints. Mater. Sci. Eng. A 673, 167–177 (2016)

    Article  CAS  Google Scholar 

  12. L. Zhang, L. Sun, Y.H. Guo, Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. J. Mater. Sci. 26(10), 1–6 (2015)

    Google Scholar 

  13. L. Yang, Y. Zhang, J. Dai et al., Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu-x Al (x = 0–0.075) lead-free solder alloy. Mater. Des. 67, 209–216 (2015)

    Article  CAS  Google Scholar 

  14. L.P. Lehman, S.N. Athavale, T.Z. Fullem et al., Growth of Sn and intermetallic compounds in Sn–Ag–Cu solder. J. Electron. Mater. 33(12), 1429–1439 (2004)

    Article  CAS  Google Scholar 

  15. H. Nishikawa, N. Iwata, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad. J. Mater. Process. Technol. 215(215), 6–11 (2015)

    Article  CAS  Google Scholar 

  16. Y. Huang, Z. Xiu, G. Wu et al., Improving shear strength of Sn–3.0Ag–0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets. Mater. Lett. 169, 262–264 (2016)

    Article  CAS  Google Scholar 

  17. C. Yang, F. Le, SWR Lee, Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints. Microelectron. Reliab. 62, 130–140 (2016)

    Article  CAS  Google Scholar 

  18. AiTingTan,AiWen Tan, Farazila Yusof, Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power. J. Alloys Compd. 705, 188–197 (2017)

    Article  CAS  Google Scholar 

  19. D.Q. Yu, C.M.L. Wu, C.M.T. Law, L. Wang, J.K.L. Lai, Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method. J. Alloys Compd. 392(1), 192–199 (2005)

    Article  CAS  Google Scholar 

  20. L. Zhang, X.Y. Fan, C.W. He et al., Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging. J. Mater. Sci. 24(9), 3249–3254 (2013)

    CAS  Google Scholar 

  21. H.K. Kim, K.N. Tu, Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B, Condens. Matter 53(23), 16027–16033 (1996)

    Article  CAS  Google Scholar 

  22. X. Hu, Y. Li, Z. Min, Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging. J. Alloys Compd. 582, 341–347 (2014)

    Article  CAS  Google Scholar 

  23. X. Hu, Y. Li, Z. Min, Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate. J. Mater. Sci. 24(6), 2027–2034 (2013)

    CAS  Google Scholar 

  24. J. Shen, M. Zhao, P. He et al., Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging. J. Alloys Compd. 574(10), 451–458 (2013)

    Article  CAS  Google Scholar 

  25. X. Hu, Z. Ke, Growth behavior of interfacial Cu–Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging. J. Mater. Sci. 25(2), 936–945 (2014)

    CAS  Google Scholar 

  26. M. Yang, Y.H. Ko, J. Bang, T.S. Kim, C.W. Lee, M. Li, Effects of Ag addition on solid-state interfacial reactions between Sn–Ag–Cu solder and Cu substrate. Mater. Charact. 124, 250–259 (2017)

    Article  CAS  Google Scholar 

  27. M. Yang, M. Li, J. Kim, Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging. Intermetallics 31(4), 177–185 (2012)

    Article  CAS  Google Scholar 

  28. A.M. Gusak, K.N. Tu, Kinetic theory of flux-driven ripening. Phys. Rev. B 66(11), 115403 (2002)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This work was supported by the Nature Science Foundation of China (Nos. 51465039, 51665038, 51765040) and Nature Science Foundation of Jiangxi Province (20161BAB206122).

Author information

Authors and Affiliations

  1. Key Lab for Robot and Welding Automation of Jiangxi Province, Mechanical and Electrical Engineering School, Nanchang University, Nanchang, 330031, China

    Tao Xu, Xiaowu Hu, Yulong Li & Xiongxin Jiang

Authors
  1. Tao Xu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaowu Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yulong Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Xiongxin Jiang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Xiaowu Hu.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Xu, T., Hu, X., Li, Y. et al. The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions. J Mater Sci: Mater Electron 28, 18515–18528 (2017). https://doi.org/10.1007/s10854-017-7799-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-017-7799-0

Search

Navigation