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Low temperature In–Bi–Zn solder alloy on copper substrate

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Abstract

In this paper, characteristic of In–32.7Bi–0.5Zn lead-free solder system have been studied. DSC shows that, In–32.7Bi–0.5Zn system alloy give low melting temperature at 72.30 °C. Lowest melting temperature ensures that the solder melts, forms a joint with the substrates, and re-solidifies within the shortest possible process time. Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for In–32.7Bi–0.5Zn solder alloys were decreasing 30.76° to 24.5° as the temperature increased from 100 to 140 °C. A significant increment of contact angle for In–32.7Bi–0.5Zn at 140 °C. The result of spreading area is inversed with the contact angle. Energy-dispersive X-ray analysis indicated two layer of intermetallic compound between the solder and the substrate; Cu5Zn8 and Cu11In9 compound.

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Authors and Affiliations

  1. Faculty of Engineering and Technology, Multimedia University, 75450, Ayer Keroh, Malacca, Malaysia

    Ervina Efzan Mhd Noor

  2. School of Materials and Mineral Resources, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Penang, Malaysia

    H. Zuhailawati

  3. Faculty of Manufacturing Engineering, Technical University of Malaysia Malacca, 75450, Ayer Keroh, Malacca, Malaysia

    Othman Radzali

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  1. Ervina Efzan Mhd Noor
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  2. H. Zuhailawati
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Correspondence to Ervina Efzan Mhd Noor.

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Noor, E.E.M., Zuhailawati, H. & Radzali, O. Low temperature In–Bi–Zn solder alloy on copper substrate. J Mater Sci: Mater Electron 27, 1408–1415 (2016). https://doi.org/10.1007/s10854-015-3904-4

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