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Growth kinetics of intermetallic layer in lead-free Sn–5Sb solder reinforced with multi-walled carbon nanotubes

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Abstract

In this study, the effects of multi-walled carbon nanotubes reinforcement on the thickness and growth kinetics of interfacial intermetallic compound (IMC) layer in Sn–5Sb solder system are investigated. In the typical study, plain Sn–5Sb solder system and carbon nanotubes reinforced solder systems (Sn–5Sb−xCNT; x = 0.01, 0.05 and 0.1 wt%) were developed via the powder metallurgy approach. The solder/Cu joints subjected to the as-reflow and isothermal aging (170 °C) conditions were systematically characterised to evaluate the growth of the IMC layer. Results suggest that the composite solders showed better results for all subjected conditions compared with the plain solder. In particular, 0.05 wt % CNTs reinforced solder system exhibited the most appreciable IMC layer suppression and diffusion coefficient among all the samples analysed in this study.

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Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    T. T. Dele-Afolabi, M. A. Azmah Hanim & M. T. Suraya

  2. Department of Aerospace Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. Norkhairunnisa

  3. Department of Chemical and Environmental Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    H. M. Yusoff

  4. Laboratory of Biocomposite Technology, Institute of Tropical Forestry and Forest Products (INTROP), Universiti Putra Malaysia, 43400, Serdang, Selangor, Malaysia

    M. A. Azmah Hanim & M. Norkhairunnisa

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  1. T. T. Dele-Afolabi
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Correspondence to T. T. Dele-Afolabi.

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Dele-Afolabi, T.T., Azmah Hanim, M.A., Norkhairunnisa, M. et al. Growth kinetics of intermetallic layer in lead-free Sn–5Sb solder reinforced with multi-walled carbon nanotubes. J Mater Sci: Mater Electron 26, 8249–8259 (2015). https://doi.org/10.1007/s10854-015-3488-z

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  • DOI: https://doi.org/10.1007/s10854-015-3488-z

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