Abstract
In this study, the effect of graphene nanosheets (GNSs) on the corrosion resistance of 96.5Sn–3Ag–0.5Cu (SAC) solder at ambient temperature in a 3.5 wt% NaCl solution was investigated using the potentiodynamic polarization method . The corrosion products were analyzed by field emission-scanning electron microscope, energy dispersive spectroscopy , and X-ray diffraction. The results showed that the GNSs affect the anodic polarization behavior of the solders. Adding GNSs enhanced the corrosion resistance of the SAC solder, as GNSs content increased to 0.03 wt%, the corrosion resistance peaked and then declined with further increment in the wt% of the GNSs. Overall, the corrosion resistance of SAC/GNSs was found to be more superior than that of the pure SAC. The mechanism of the corrosion resistance improvement can be explained by the formation of a compact corrosion layer of the GNSs. This provides an inert physical barrier to the initiation and development of corrosion. As the GNSs content further increased (more than 0.03 wt%), the corrosion resistance of the SAC/GNSs solder decreased.
Similar content being viewed by others
References
F. Rosalbino, E. Angelini, G. Zanicchi, R. MarazzaE, Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys. J. Electron. Mater. 109, 386–391 (2008)
Y. Li, K. Moon, C.P. Wong, Electronics without lead. Science 308, 1419–1420 (2005)
I.E. Anderson, Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. J. Mater. Sci. Mater. Electron. 18, 55–76 (2007)
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng., R 44, 1–44 (2004)
Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, L.Y. Xu, S.R. Zhang, A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints. J. Phys. D Appl. Phys. 42, 125411 (2009)
F.B. Song, S.W.R. Lee, Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results, in 56th Electronic Components and Technology Conference 2006, vol. 1–2, (2006), pp. 891–898
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn–Ag–Cu lead-free solder. J. Electron. Mater. 39, 223–229 (2010)
J.S. Lee, K.M. Chu, R. Patzelt, D. Manessis, A. Ostmann, D.Y. Jeon, Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development. Microelectron. Eng. 85, 1577–1583 (2008)
H.T. Lee, Y.H. Lee, Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints. Mater. Sci. Eng. A 419, 172–180 (2006)
L.C. Tsao, S.Y. Chang, Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Mater. Des. 31, 990–993 (2010)
X.H. Chen, C.S. Chen, H.N. Xiao, F.Q. Cheng, G. Zhan, G.J. Yi, Corrosion behavior of carbon nanotubes–Ni composite coating. Surf. Coat. Technol. 191, 351–356 (2005)
Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 22, 315–322 (2011)
Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 23, 1108–1115 (2012)
A.K. Geim, K.S. Novoselov, The rise of graphene. Nat. Mater. 6, 183–191 (2007)
S. Park, R. Ruoff, Chemical methods for the production of graphenes. Nat. Nanotechnol. 4, 217–224 (2009)
X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu, Effect of graphene nanosheets reinforcement on the performance of Sn–Ag–Cu lead-free solder. Mater. Sci. Eng. A 562, 25–32 (2013)
Q.V. Bui, N.D. Nam, B.I. Noh, A. Kar, J.G. Kim, S.B. Jung, Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Mater. Corros. 61, 30–33 (2010)
J.Y. Wang, Z.Q. Li, G.L. Fan, H.H. Pan, Z.X. Chen, D. Zhang, Reinforcement with graphene nanosheets in aluminum matrix composites. Scr. Mater. 66, 594–597 (2012)
H.T. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)
S.W. Chen, C.H. Wang, C.K. Lin, C.N. Chiu, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. Mater. Electron. 18, 19–37 (2007)
X. Zhao, Q. Zhang, D. Chen, Enhanced mechanical properties of graphene-based poly(vinyl alcohol) composites. Macromolecules 43, 2357–2363 (2010)
S. Vadukumpully, J. Paul, N. Mahanta, S. Valiyaveettil, Flexible conductive graphene/poly(vinyl chloride) composite thin films with high mechanical strength and thermal stability. Carbon 49, 198–205 (2011)
H. Ming, J. Wang, Z. Zhang, S. Wang, E.H. Han, W. Ke, Multilayer graphene: a potential anti-oxidation barrier in simulated primary water. J. Mater. Sci. Technol. 30, 1084–1087 (2014)
Y.D. Han, L. Chen, H.Y. Jing, S.M.L. Nai, J. Wei, L.Y. Xu, Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn–Ag–Cu Solder. J. Electron. Mater. 42, 3559–3566 (2013)
Y.H. Hu, S.B. Xue, H. Ye, Z. Xiao, L.L. Gao, G. Zeng, Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu joints with aging treatment. Mater. Des. 34, 768–775 (2012)
L.C. Tsao, T.T. Lo, S.F. Peng, S.Y. Chang, Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder. in 11th International Conference on Electronic Packaging Technology and High Density Packaging. ,(2010), pp. 1013–1017
Y. Liu, Y.F. Cheng, Role of second phase particles in pitting corrosion of 3003 Al alloy in NaCl solution. Mater. Corros. 61, 211–217 (2010)
A. Pardo, M.C. Merino, A.E. Coy, R. Arrabal, F. Viejo, E. Matykona, Corrosion behaviour of magnesium/aluminium alloys in 3.5 wt% NaCl. Corros. Sci. 50, 823–834 (2008)
G. Ben-Hamu, A. Eliezer, E.M. Gutman, RETRACTED: electrochemical behavior of magnesium alloys strained in buffer solutions. Electrochim. Acta 52, 304–313 (2006)
L. Zhang, Effects of Grain Size on the Corrosion Behaviors of Zinc and Trivalent Chromium Passivation Film on Zinc. A Dissertation for the Degree of M. Eng, (2008), p. 12
B.M. Praveen, T.V. Venkatesha, Y. Arthoba Naik, K. Prashantha, Corrosion studies of carbon nanotubes–Zn composite coating. Surf. Coat. Technol. 201, 5836–5842 (2007)
Acknowledgments
The authors acknowledge the research funding by National Natural Science Foundation of China (Grant No. 51205282) and the Research Fund for the Doctoral Program of Higher Education of China (20120032120019).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Xu, L.Y., Zhang, Z.K., Jing, H.Y. et al. Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders. J Mater Sci: Mater Electron 26, 5625–5634 (2015). https://doi.org/10.1007/s10854-015-3112-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-015-3112-2