Skip to main content
SpringerLink
Log in

Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

In this study, the effect of Ni-coated carbon nanotubes (Ni-CNTs) on the corrosion resistance of 95.8Sn-3.5Ag-0.7Cu (SAC) solder at ambient temperature in 3.5 wt.% NaCl solution was investigated using the potentiodynamic polarization method. The corrosion products were analyzed by field-emission scanning electron microscopy (S4800), energy-dispersive spectroscopy, and x-ray diffraction. The results showed that addition of Ni-CNTs enhanced the corrosion resistance of the SAC solder and that increasing the content of Ni-CNTs made the effect more evident. The mechanism of the corrosion resistance improvement is the formation of a compact corrosion layer of Ni-CNTs that provides an inert physical barrier to the initiation and development of corrosion. Furthermore, in the corrosion microcell produced by the Ni-CNTs dispersed in the SAC solder, the Ni-CNTs act as a third phase (electrode) which contributes to reducing the galvanic corrosion between Sn anode and Ag3Sn cathode. Hence, the corrosion resistance of the composite solders was improved.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. F. Rosalbino, E. Angelini, G. Zanicchi, and R. MarazzaE, J. Electron. Mater. 109, 386 (2008).

    CAS  Google Scholar 

  2. C.H. Tsai, J.M. Song and Y.P. Fu, 2009 4th Int. Microsyst. Packag. Assem. Circuits Technol. Conf. 656, 393 (2009).

  3. Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, and J. Wei, J. Mater. Sci. Mater. Electron. 22, 315 (2011).

    Article  CAS  Google Scholar 

  4. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Mater. Sci. Eng. R 44, 1–44 (2004).

    Article  Google Scholar 

  5. Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, L.Y. Xu and S.R. Zhang, J. Phys. D Appl. Phys. 42, 125411 (2009).

    Google Scholar 

  6. F.B. Song and S.W.R. Lee, 56th Electron Compon. Technol. Conf. 1–2, 891 (2006).

  7. Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, J. Electron. Mater. 39, 223 (2010).

    Article  CAS  Google Scholar 

  8. J.S. Lee, K.M. Chu, R. Patzelt, D. Manessis, A. Ostmann, and D.Y. Jeon, Microelectron. Eng. 85, 1577 (2008).

    Article  CAS  Google Scholar 

  9. H.T. Lee and Y.H. Lee, Mater. Sci. Eng. A 419, 172 (2006).

    Article  Google Scholar 

  10. W.X., Dong, Y.W. Shi, Z.D. Xia, Y.P. Lei and F. Guo, J. Electron. Mater. 37, 982 (2008).

    Google Scholar 

  11. K.M. Kumar, V. Kripesh, and A.O. Andrew, J. Alloy. Compd. 450, 229 (2008).

    Article  CAS  Google Scholar 

  12. K.M. Kumar, V. Kripesh, and A.A.O. Tay, J. Alloy. Compd. 455, 148 (2008).

    Article  CAS  Google Scholar 

  13. S.M.L. Nai, J. Wei, and M. Gupta, Mater. Sci. Eng. A 423, 166 (2006).

    Article  Google Scholar 

  14. S.M.L. Nai, Y.D. Han, H.Y. Jing, C.M. Tan, J. Wei and M. Gupta, Nanotechnol. Conf. Expo 2009 2, 538 (2009).

  15. T.P. Kumar, R. Ramesh, Y.Y. Lin, and G.T.K. Fey, Electrochem. Commun. 6, 520 (2004).

    Article  CAS  Google Scholar 

  16. J. Wei, S.M.L. Nai, X.F. Ang, and K.P. Yung, Advanced High Density Interconnect Materials and Techniques. 2009 International Conference on Electronic Packaging Technology & High Density Packaging (Icept-Hdp 2009), Vol. 1273 (Shanghai, China, 2009) pp. 1203–1210.

  17. M.C. Turhan, Q.Q. Li, H. Jha, R.F. Singer, S. Virtanen, and E. Phys, Status Solidi A 201, R53 (2004).

    Article  Google Scholar 

  18. M. Olek, K. Kempa, S. Jurga, and M. Giersig, Langmuir 21, 3146 (2005).

    Article  CAS  Google Scholar 

  19. P. Yao, P. Liu, and J. Liu, J. Alloy. Compd. 462, 73 (2008).

    Article  CAS  Google Scholar 

  20. E. Durgun, S. Dag, V.M.K. Bagci, O. Gulseren, T. Yildirim, and S. Ciraci, Phys. Rev. B 67, 201401 (2003).

    Article  Google Scholar 

  21. S.H. Yang, W.H. Shin, J.W. Lee, S.Y. Kim, S.I. Woo, and J.K. Kang, J. Phys. Chem. B 110, 13941 (2006).

    Article  CAS  Google Scholar 

  22. Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, J. Mater. Sci. Mater. Electron. 23, 1108 (2012).

    Google Scholar 

  23. Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, Intermetallics 31, 72 (2012).

    Article  Google Scholar 

  24. Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, J. Electron. Mater. 41, 2478 (2012).

    Article  CAS  Google Scholar 

  25. Q.V. Bui, N.D. Nam, B.I. Noh, A. Kar, J.G. Kim, and S.B. Jung, Mater. Corros. 61, 30 (2010).

    Article  CAS  Google Scholar 

  26. N.N. Aung, W. Zhou, C.S. Goh, S.M.L. Nai, and J. Wei, Corros. Sci. 52, 1551 (2010).

    Article  CAS  Google Scholar 

  27. X.H. Chen, C.S. Chen, H.N. Xiao, F.Q. Cheng, G. Zhan, and G.J. Yi, Surf. Coat. Technol. 191, 351 (2005).

    Article  CAS  Google Scholar 

  28. M. Alishahi, S.M. Monirvaghefi, A. Saatchi, and S.M. Hosseini, Appl. Surf. Sci. 258, 2439 (2012).

    Article  CAS  Google Scholar 

  29. D. Li, P.P. Conway, and C.Q. Liu, Corros. Sci. 50, 995 (2008).

    Article  CAS  Google Scholar 

  30. A. Pardo, M.C. Merino, A.E. Coy, R. Arrabal, F. Viejo, and E. Matykona, Corros. Sci. 50, 823 (2008).

    Article  CAS  Google Scholar 

  31. D.Q. Yu, C.M.L. Wu, and L. Wang, 16th International Corrosion Conference (Beijing, China, 2005), pp. 19–24.

  32. L.C. Tsao, T.T. Lo, S.F. Peng, and S.Y. Chang, 11th International Conference on Electronic Packaging Technology & High Density Packaging (Shanghai, China, 2010), pp. 1013–1017.

  33. G. Ben-Hamu, A. Eliezer, and E.M. Gutman, Electrochim. Acta 52, 304 (2006).

    Article  CAS  Google Scholar 

  34. Y. Liu and Y.F. Cheng, Mater. Corros. 61, 211 (2010).

    Article  CAS  Google Scholar 

  35. B.M. Praveen, T.V. Venkatesha, Y. Arthoba Naik, and K. Prashantha, Surf. Coat. Technol. 201, 5836 (2007).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, China

    Y. D. Han, L. Chen, H. Y. Jing & L.Y. Xu

  2. Tianjin Key Laboratory of Advanced Joining Technology, Tianjin, 300072, China

    Y. D. Han, L. Chen, H. Y. Jing & L.Y. Xu

  3. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore

    S. M. L. Nai & J. Wei

Authors
  1. Y. D. Han
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. L. Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. H. Y. Jing
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. S. M. L. Nai
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. J. Wei
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. L.Y. Xu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to L.Y. Xu.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Han, Y.D., Chen, L., Jing, H.Y. et al. Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder. J. Electron. Mater. 42, 3559–3566 (2013). https://doi.org/10.1007/s11664-013-2763-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-013-2763-0

Keywords

Search

Navigation