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Stress relaxation behavior of lead-free solder joint

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Abstract

In this work, stress relaxation behavior of Sn3.5Ag0.5Cu solder joint was investigated under 398 K. Three strain ranges (4, 6, and 8 %) and two strain rates (0.002 and 0.01/s) were utilized. The results show that the effect of strain range on stress relaxation is not significant under high strain rate. However, it firstly increases with strain range and then decreases after approaching the maximum value under low strain rate. Moreover, Stress relaxes more under high strain rate than that under low strain rate. Feltham equation can describe the stress relaxation behavior well under high strain rate. After a certain relaxation time, crack appears at the corner of the solder joint and the stress appears to increase a little.

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Acknowledgments

This study was financially supported by National Natural Science Foundation of China (No. 51275007) and Key Project of Scientific Research Plan of Beijing Municipal Education Commission (No. KZ201410005009).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing, 100024, People’s Republic of China

    Yongxin Zhu, Xiaoyan Li & Ruiting Gao

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  1. Yongxin Zhu
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  2. Xiaoyan Li
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  3. Ruiting Gao
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Correspondence to Yongxin Zhu.

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Zhu, Y., Li, X. & Gao, R. Stress relaxation behavior of lead-free solder joint. J Mater Sci: Mater Electron 26, 3020–3024 (2015). https://doi.org/10.1007/s10854-015-2792-y

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  • DOI: https://doi.org/10.1007/s10854-015-2792-y

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