Skip to main content
SpringerLink
Log in

Nano-sized boron nitride epoxy composites for underfill application: effect of diluent and filler loading

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Effect of ethanol as diluent in the preparation of nano-sized boron nitride filler filled epoxy composites was investigated. Ethanol at 10 wt% was used to reduce the viscosity of epoxy composites. Filler loading up to 6 vol% is able to be added in the diluent system, as compared to 4 vol% in the non-diluent system. Sonication process was used to facilitate filler dispersion. At 4 vol% filler loadings, diluent system showed 36 % higher in flow rates than non-diluent system. Apparently, non-diluent system showed higher flexural strength, modulus, thermal conductivity, and lower coefficient of thermal expansion (CTE) than that of diluent system. However, when the filler loading is up to 6 vol% for the diluent system, CTE is reduced 4.3 % and thermal conductivity increased 6.9 % if compared to 4 vol% non-diluent system. In general, it is concluded that diluent system at 6 vol% exhibit better flowability, CTE and thermal conductivity to fabricate underfill materials.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. C.P. Wong, Fellow, IEEE, M.M. Wong, IEEE Trans. Compon. Packag. Manuf. Technol. 22(1), 21 (1999)

  2. J.W. Wan, W.J. Zhang, D.J. Bergstrom, Microelectron. J. 38(1), 67 (2007)

    Article  Google Scholar 

  3. E. Madenci, S. Shkarayev, R. Mahajan, J. Electron. Packag. 120(4), 336 (1998)

    Article  Google Scholar 

  4. C.P. Wong, Fellow, IEEE, M.B. Vincent, S. Shi, IEEE Trans. Compon. Packag. Manuf. Technol. A 21(2), 360 (1998)

  5. T. Braun, K.F. Becker, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Microelectron. Reliab. 46(1), 144 (2006)

    Article  Google Scholar 

  6. K. Darbha, J.H. Okura, A. Dasgupta, IEEE Compon. Packag. Manuf. Technol. Soc. A 21(2), 275 (1998)

  7. H. Mavoori, S. Jin, JOM 50(6), 70 (1998)

    Article  Google Scholar 

  8. H.T. Vo, M. Todd, F.G. Shi, A.A. Shapiro, M. Edward, Microelectron. J. 32(4), 331 (2001)

    Article  Google Scholar 

  9. J. Wang, Microelectron. Reliab. 47(12), 1958 (2007)

    Article  Google Scholar 

  10. S. Muhammad, Firdaus, J. Mariatti. J. Eng. Sci. 9, 89 (2013)

    Google Scholar 

  11. W.S. Lee, J. Yu, Diam. Relat. Mater. 14(10), 1647 (2005)

    Article  Google Scholar 

  12. W.S. Lee, I.Y. Han, J. Yu, S.J. Kim, K.Y. Byun, Thermochim. Acta 455, 148 (2007)

    Article  Google Scholar 

  13. P.L. Teh, M. Mariatti, H.M. Akil, K.N. Seethamaru, A.N.R. Wagiman, K.S. Beh, J. Compos. Mater. 42(2), 129 (2008)

    Google Scholar 

  14. M.F. Shih, W.B. Young, Microelectron. Reliab. 49(12), 1555 (2009)

    Article  Google Scholar 

  15. B. Dewprashad, E.J. Eisenbraun, J. Chem. Educ. 71(4), 290 (1994)

    Article  Google Scholar 

  16. M.T. Huang, H. Ishida, Polym. Polym. Compos. 7(4), 233 (1999)

    Google Scholar 

  17. R. Voo, M. Mariatti, L.C. Sim, J. Plast. Film Sh. 27(4), 331 (2011)

    Article  Google Scholar 

  18. S.Y. Fu, X.Q. Feng, B. Lauke, Y.W. Mai, Compos. Part B Eng. 39(6), 933 (2008)

    Article  Google Scholar 

  19. S. Muhammad Firdaus, M. Mariatti, J. Mater. Sci. Mater. Electron. 23(7), 1293 (2011)

  20. M. Chaturvedi, Y.L. Shen, Acta Mater. 46(12), 4287 (1998)

    Article  Google Scholar 

  21. W.D. Fei, M. Hu, C.K. Yao, Mater. Chem. Phys. 77(3), 882 (2003)

    Article  Google Scholar 

  22. S. Tognana, W. Salgueiro, A. Samoza, J. A. Pomarico, H. F. Ranea-Sandoval, Mater. Sci. and Eng.: B, 157(1-3), 26 (2009)

  23. K.L. Chan, M. Mariatti, Z. Lockman, L.C. Sim, J. Mater. Sci. Mater. Electron. 21(8), 772 (2010)

    Article  Google Scholar 

  24. H. Zhou, S. Zhang, M. Yang, Compos. Sci. Technol. 67(6), 1035 (2007)

    Article  Google Scholar 

  25. M.S. Nurul, M. Mariatti, J. Thermoplast. Compos. Mater. 26(5), 627 (2011)

    Article  Google Scholar 

  26. N.A. Farrah, J. Mariatti, S. Palaniandy, A.A. Khairun, Compos. Sci. Technol. 68(2), 346 (2008)

    Article  Google Scholar 

  27. S. Palaniandy, A.A. Khairun, J. Mariatti, N.A. Farrah, H. Hashim, S.H. Syed Fuad, Powder Technol. 185(1), 54 (2008)

Download references

Acknowledgments

The present work was supported by the research grant from Ministry of Education Malaysia for granting Explorating Research Grant Scheme (ERGS). Special thanks also to MyMaster financing program (MyBrain15) and Graduate Assistant Scheme.

Author information

Authors and Affiliations

  1. School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300, Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia

    S. Muhammad Firdaus & M. Mariatti

Authors
  1. S. Muhammad Firdaus
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. Mariatti
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to M. Mariatti.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Muhammad Firdaus, S., Mariatti, M. Nano-sized boron nitride epoxy composites for underfill application: effect of diluent and filler loading. J Mater Sci: Mater Electron 26, 774–783 (2015). https://doi.org/10.1007/s10854-014-2463-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2463-4

Keywords

Search

Navigation