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Properties of calcium copper titanate and barium titanate filled epoxy composites for electronic applications: effect of filler loading and hybrid fillers

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Abstract

Inorganic ceramics such as calcium copper titanate, CaCu3Ti4O12 (CCTO) and barium titanate (BaTiO3) were used as fillers to produce epoxy thin film composites for capacitor application. The effects of filler types and loading range on the dielectric, tensile, morphology, and thermal properties of the epoxy thin film composites were determined. Results showed that epoxy thin film composites with 20 vol% filler loading of CCTO and BaTiO3 showed good dielectric properties, thermal stability, and thermal conductivity. However, the tensile properties of the CCTO/epoxy thin film composite was reduced as the filler loading increased. On the other hand, the tensile properties of BaTiO3/epoxy thin film composite improved as the filler loading increased. Hybrid fillers CCTO and BaTiO3 filled epoxy composites were fabricated and the effect of hybrid fillers on the dielectric properties and morphology of the epoxy thin film composites were investigated. Results indicated that positive hybrid effect in dielectric constant and dielectric loss showed by the hybrid composites.

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References

  1. W.S. Mao, J. Endruw, K.Y. Wen, W.J. Wen, 9th Electron. Packag. Tech. Conf. (EPTC), IEEE (2007)

  2. Y. Rao, S. Ogitani, P. Koul, C.P. Wong, J. Appl. Polym. Sci. 83, 1084 (2002)

    Article  Google Scholar 

  3. C.S. Dong, L.J. Yeon, H.J. Gul, P.K. Wook, J. Mater. Sci. Eng. B110, 233 (2004)

    Google Scholar 

  4. L. Jiongxin, M. Kyoung-Sik, K. Byung-Kook, C.P. Wong, J. Polym. 48(6), 1510 (2007)

    Article  Google Scholar 

  5. W.C. Ching, C.Y. Chung, S.C. Cheng, Y.C. Fu, J. Eur. Polym. 45, 1442 (2009)

    Article  Google Scholar 

  6. L. Jiongxin, C.P. Wong, IEEE Trans. Dielectr. Electr. Insul. 15(5), 1322 (2008)

    Article  Google Scholar 

  7. K. Taeyun, I.K. Angus, M.J. Paul, T.C. Robert, Thin Solid Films 515, 7331 (2007)

    Article  Google Scholar 

  8. M. Alam, M.H. Azarian, M. Osterman, M. Pecht, Microelectron. Reliab. 51(5), 946 (2011)

    Article  Google Scholar 

  9. L. Xie, X. Huang, C. Wu, P. Jiang, J. Mater. Chem. 21, 5897 (2011)

    Article  Google Scholar 

  10. Z.M. Dang, J.W. Zha, Y. Yu, T. Zhou, H.T. Song, S.T. Li, IEEE Trans. Dielectr. Electr. Insul. 18(5), 1518 (2011)

    Article  Google Scholar 

  11. X. Huang, L. Xie, Z. Hu, P. Jiang, IEEE Trans. Dielectr. Electr. Insul. 18(2), 375 (2011)

    Article  Google Scholar 

  12. H.J. Ming, Y.W. Huai, Y.W. Chun, C.Y. Wen, C.Y. Yu, J. Mater. Res. Bull. 40, 1662 (2005)

    Article  Google Scholar 

  13. J.R. Yoon, H.J. Woo, K.M. Lee, Trans. Electr. Electron. Mater. 10(4), 449 (2009)

    Article  Google Scholar 

  14. L. Suibin, S. Rong, Z. Jingwei, Y. Shuhui, D. Ruxu, Z. Zhijun, Intern. Conf. Electron. Packag. Tech. High Density Pack. (ICEPT-HDP), IEEE (2009)

  15. M.A. Subramanian, D. Li, N. Duran, B.A. Reisner, A.W. Sleight, J. Solid State Chem. 151, 323 (2000)

    Article  Google Scholar 

  16. C.C. Homes, T. Vogt, S.M. Shapiro, S. Wakimoto, A.P. Ramirez, Science 293, 673 (2001)

    Article  Google Scholar 

  17. M.A. Subramanian, D. Li, N. Duan, J. Solid State Chem. 151, 323 (2000)

    Article  Google Scholar 

  18. M. Nakach, J.R. Authelin, A. Chamayou, J. Dodds, J. Miner. Proc. 74, 173 (2004)

    Article  Google Scholar 

  19. L. Ramajo, M. Reboredo, M. Castro, Compos. Part A 36, 1267 (2005)

    Article  Google Scholar 

  20. L. Ramajo, M.A. Ramirez, P.R. Bueno, M.M. Reboredo, Mater. Res. 11(1), 85 (2008)

    Article  Google Scholar 

  21. B.S. Prakash, K.B.R. Varma, J. Compos. Sci. Technol. 67, 2362 (2007)

    Google Scholar 

  22. N.G. Devaraju, E.S. Kim, B.I. Lee, Microelectron. Eng. 82(1), 71 (2005)

    Article  Google Scholar 

  23. P. Thomas, K.T. Varughese, K. Dwarakanath, K.B.R. Varma, J. Compos. Sci. Technol. 70, 539 (2010)

    Article  Google Scholar 

  24. G. Tsangaris, N. Kouloumbi, S. Kyvelidis, Mater. Chem. Phys. 44(3), 245 (1996)

    Article  Google Scholar 

  25. R. Voo, M. Mariatti, L.C. Sim, J. Plast. Film Sheet. 27, 331 (2011)

    Article  Google Scholar 

  26. C.L. Wu, M.Q. Zhang, M.Z. Rong, K. Friedrich, J. Compos. Sci. Technol. 62, 1327 (2002)

    Article  Google Scholar 

  27. C.L. Poh, M. Mariatti, M.N. Ahmad Fauzi, C.H. Ng, C.K. Chee, T.P. Chuah, J. Mater. Sci. Mater. Electron. 25, 2111 (2014)

    Article  Google Scholar 

  28. H. Schonhorn, J. Plast. Film Sheet. 1, 163 (1985)

    Article  Google Scholar 

  29. F.C. Campbell, Introduction to composite materials, structural composite materials (ASM International, OH, 2010), p. 8

  30. R. Voo, M. Mariatti, L.C. Sim, J. Polym. Adv. Technol. 23, 1620 (2012)

    Article  Google Scholar 

  31. S.H. Xie, B.K. Zhu, J.B. Li, X.Z. Wei, Z.K. Xu, Polym. Test 23(7), 797 (2004)

    Article  Google Scholar 

  32. A. Leszczynska, J. Njuguna, K. Pielichowski, J.R. Banerjee, Thermochim. Acta 453, 75 (2007)

    Article  Google Scholar 

  33. N.G. Devaraju, E.S. Kim, B.I. Lee, Microelectron. Eng. 82(1), 71 (2005)

    Article  Google Scholar 

  34. R. Kochetov, T. Andritsch, U. Lafont, P. H. F. Morshuis, J.J. Smit, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 2009

  35. K.A. Malini, E.M. Mohammed, S. Sindhu, J. Mater. Sci. 36, 5551 (2001)

    Article  Google Scholar 

Download references

Acknowledgments

The authors gratefully acknowledge the support of the Universiti Sains Malaysia and the Ministry of Education, and Explorating Research Grant Scheme (ERGS) for granting the research fund used for this project (Project No. 6730109).

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Correspondence to M. Mariatti.

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Saidina, D.S., Mariatti, M. & Julie, M.J. Properties of calcium copper titanate and barium titanate filled epoxy composites for electronic applications: effect of filler loading and hybrid fillers. J Mater Sci: Mater Electron 25, 4923–4932 (2014). https://doi.org/10.1007/s10854-014-2253-z

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  • DOI: https://doi.org/10.1007/s10854-014-2253-z

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