Skip to main content
SpringerLink
Log in

The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this paper, the effects of Mn powder on fusion property of Sn3.0Ag0.5Cu solder alloy and microstructures as well as tensile property of the solder joints of Sn3.0Ag0.5Cu/Cu were investigated by differential scanning calorimetry analysis, scanning electron microscopy and tensile tests. The results showed that the addition of Mn dramatically suppressed under cooling of SnAgCu solder alloy. Mn addition contributed to the growth of Cu6Sn5 intermetallic compound layers since it provided nucleation sites for Cu6Sn5 at the solder joints. Moreover, Mn addition increased the hardness of the solder alloys and reduced the tensile strength of SnAgCu/Cu solder joints. During aging, the growth of IMC layers of SnAgCuMn/Cu solder joints was slower than that of SnAgCu/Cu solder joints, and the tensile strength of all the solder joints increased after aging.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. K. Zeng, K.N. Tu, Master. Sci. Eng. R 38, 55 (2002)

    Article  Google Scholar 

  2. M. Abtewa, G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000)

    Article  Google Scholar 

  3. T. Laurila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005)

    Article  Google Scholar 

  4. D.R. Frear, J.W. Jang, J.K. Lin, C. Zhang, JOM 53, 1047 (2001)

    Article  Google Scholar 

  5. W.P. Liu, N.C. Lee, JOM 59, 26 (2007)

    Article  Google Scholar 

  6. H.Y. Lee, J.G. Duh, J. Electron. Mater. 35, 494 (2006)

    Article  Google Scholar 

  7. J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, H.X. Gao, J. Electron. Mater. 35, 1672 (2006)

    Article  Google Scholar 

  8. F. Tai, F. Guo, Z.D. Xia, Y.P. Lei, Y.F. Yan, J.P. Liu, Y.W. Shi, J. Electron. Mater. 34, 1357 (2005)

    Article  Google Scholar 

  9. Y.W. Shi, J.P. Liu, Y.F. Yan, Z.D. Xia, Y.P. Lei, F. Guo, X.Y. Li, J. Electron. Mater. 37, 507 (2008)

    Article  Google Scholar 

  10. P. Liu, P. Yao, J. Liu, J. Electron. Mater. 37, 874 (2008)

    Article  Google Scholar 

  11. S.T. Kao, Y.C. Lin, J.G. Duh, J. Electron. Mater. 35, 486 (2006)

    Article  Google Scholar 

  12. W.P. Liu, N.C. Lee, A. Porras, M. Ding, A. Gallagher, A. Huang, S. Chen, J.C.B. Lee, Electronic components and technology conference 994 (2009)

  13. L.W. Lin, J.M. Song, Y.S. Lai, Y.T. Chiu, N.C. Lee, J.Y. Uan, Microelectron. Reliab. 49, 235 (2009)

    Article  Google Scholar 

  14. M. Ghosh, A. Kar, S.K. Das, A.K. Ray, Metall. Mater. Trans. A. 40, 2369 (2009)

    Article  Google Scholar 

  15. M. Ghosh, M.K. Gunjan, S.K. Das, A. Kar, R.N. Ghosh, A.K. Ray, Mater. Sci. Technol. 26, 610 (2010)

    Article  Google Scholar 

  16. K.S. Kim, S.H. Huh, K. Suganuma, Microelectron. Reliab. 43, 259 (2003)

    Article  Google Scholar 

  17. K.S. Kim, S.H. Huh, K. Suganuma, Mater. Sci. Engineer. A 333, 106 (2002)

    Article  Google Scholar 

  18. C.M. Chuang, K.L. Lin, J. Electron. Mater. 32, 1426 (2003)

    Article  Google Scholar 

  19. E.A. Brandes, G.B. Brook, Smithells metals reference book, (Butterworth Heinemann, Oxford, United Kingdom, 1998), pp. 13–16 and 13–19

  20. W. Engelmaier, in Solder attachment reliability, ed. by J.H. Lau (Van Nostrand Reinhold, New York, 1991), p. 549

    Google Scholar 

Download references

Acknowledgments

This project is supported by a National Natural Science Foundation of China (Grant No. 51375511) and Fundamental Research Funds for the Central Universities of China (Grant No. CDJZR12138801 and CDJZR13130033).

Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

    Jun Shen, Peipei He, Tao Zhang, Yang Li, Yayun Pu & Jie Chen

Authors
  1. Jun Shen
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Peipei He
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tao Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yang Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Yayun Pu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Jie Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jun Shen.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Shen, J., He, P., Zhang, T. et al. The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints. J Mater Sci: Mater Electron 25, 4779–4785 (2014). https://doi.org/10.1007/s10854-014-2233-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2233-3

Keywords

Search

Navigation