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Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder

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Abstract

The Sn–3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) at different temperature gradients (G = 1.43–4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3–500 μm/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, λ L and transverse section, λ T ) and mechanical properties (microhardness, HV and ultimate tensile strength, σ UTS ) of Sn–3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing.

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Acknowledgments

This project was supported by the Niğde University Scientific Research Project Unit under Contract No: FEB 2009/02. The authors thank Prof. Fahrettin Ozturk and Emre Esener, for their continuous support and laboratory facilities.

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  1. Faculty of Arts and Sciences, Department of Physics, Niğde University, 51240, Niğde, Turkey

    E. Çadırlı & M. Şahin

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  1. E. Çadırlı
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  2. M. Şahin
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Correspondence to E. Çadırlı.

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Çadırlı, E., Şahin, M. Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder. J Mater Sci: Mater Electron 23, 31–40 (2012). https://doi.org/10.1007/s10854-011-0398-6

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  • DOI: https://doi.org/10.1007/s10854-011-0398-6

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