Skip to main content
SpringerLink
Log in

Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The effects of trace amounts of rare earth (RE) additions on the melting property and microstructural evolution of SnBiAg/Cu solder joints were studied by differential scanning calorimetric test and microstructural observation. The results indicated that with the increase of RE additions, the solidus temperature decreased and the mushy temperature zone increased slightly in SnBiAg–xRE (x = 0.25, 0.5, 0.75 and 1.0) solder alloys. The microstructures of the Bi–rich dendrites in SnBiAg–xRE solder alloys were refined by the additions of minor RE elements. However, too many RE elements added into solder matrices led to the formation of large RE(Bi,Sn)3 intermetallic compound (IMC) which weakened the adsorption effect of RE elements on the Bi–rich dendrites. In addition, the thickness of the Cu6Sn5 IMC layers of SnBiAg–xRE/Cu solder joints were reduced remarkably due to the adsorption effect of RE elements at the interfaces of the Sn element and the Cu6Sn5 IMC layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. K.N. Tu, K. Zeng, Mater. Sci. Eng. R 34, 1 (2001)

    Article  Google Scholar 

  2. M. Abtewa, G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000)

    Article  Google Scholar 

  3. W.P. Liu, N.C. Lee, JOM 59, 26 (2007)

    Article  CAS  Google Scholar 

  4. X.F. Li, F.Q. Zu, H.F. Ding et al., Phys. Lett. A 354, 325 (2006)

    Article  CAS  Google Scholar 

  5. J.F. Li, S.H. Mannan, M.P. Clode, D.C. Whalley, D.A. Hutt, Acta Mater. 54, 2907 (2006)

    Article  CAS  Google Scholar 

  6. K. Suganuma, Lead-free Soldering Technology, X. Ning (Trans.) (Beijing Science Press, 2002), p. 51

  7. H.X. Jia, J.L. Huang, K.K. Zhang, J. Luoyang Inst Technol. 25, 11 (2004)

    Google Scholar 

  8. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Mater. Sci. Eng. R 44, 1 (2004)

    Article  Google Scholar 

  9. C.M.L. Wu, C.M.T. Law, D.Q. Yu, L. Wang, J. Electron. Mater. 32, 63 (2003)

    Article  CAS  Google Scholar 

  10. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, J. Mater. Res. 31, 3146 (2002)

    Article  Google Scholar 

  11. Z.D. Xia, Z.G. Chen, Y.W. Shi, N. Mu, N. Sun, J. Electron. Mater. 31, 564 (2002)

    Article  CAS  Google Scholar 

  12. D.Q. Yu, J. Zhao, L. Wang, J. Alloys Compd. 376, 170 (2004)

    Article  CAS  Google Scholar 

  13. Y.W. Shi, J. Tian, H. Hao, Z.D. Xia, Y.P. Lei, F. Guo, J. Alloys Compd. 453, 180 (2008)

    Article  CAS  Google Scholar 

  14. W.X. Dong, Y.W. Shi, Z.D. Xia, Y.P. Lei, F. Guo, J. Electron. Mater. 37, 982 (2008)

    Article  CAS  Google Scholar 

  15. Y.Y. Shiue, T.H. Chuang, J. Alloys Compd. 491, 610 (2010)

    Article  CAS  Google Scholar 

  16. T. Lyman, The Ninth Edition of Metals Handbook (ASM International, Ohio, 1985), p. 126

    Google Scholar 

  17. B. Huang, N.C. Lee, Int. Symp. Microelectron. Proc. 3906, 711 (1999)

    Google Scholar 

  18. T.B. Massalskl, Binary Alloy Phase Diagrams (ASM International, Ohio, 1990)

    Google Scholar 

  19. J. Zhou, Y. Sun, F. Xue, J. Alloys Compd. 397, 260 (2005)

    Article  CAS  Google Scholar 

  20. H.T. Lee, Y.F. Chen, J. Electron. Mater. 38, 10–2148 (2009)

    Article  Google Scholar 

  21. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S.L. Yu, G. Zeng, Microelectron. Eng. 87, 2025 (2010)

    Article  CAS  Google Scholar 

  22. Q.J. Zhai, S.K. Guan, Q.Y. Shang, Alloy Thermo–Mechanism: Theory and Application (Metallurgy Industry Press, Beijing, 1999), pp. 156–160

    Google Scholar 

  23. L. Ye, Z.H. Lai, J. Liu, A. Thölén, IEEN Trans. Electron. Packag. Manuf. 22, 228 (1999)

    Article  Google Scholar 

  24. B. Li, Y.W. Shi, Y.P. Lei, F. Guo, Z.D. Xia, B. Zong, J. Electron. Mater. 34, 217 (2005)

    Article  Google Scholar 

  25. X. Ma, Y.Y. Qian, F. Yoshida, J. Alloys Compd. 334(1), 224 (2002)

    Article  CAS  Google Scholar 

  26. D. Ma, W.D. Wang, S.K. Lahiri, J. Appl. Phys. 91, 5–3312 (2002)

    Google Scholar 

Download references

Acknowledgments

This research was financial supported by a Key Scientific and Technological Project of Chongqing (Project No. CSTC, 2009AC4046), a Natural Science Foundation Project of CQ CSTC (Project No. CSTC, 2010BB4039), Fundamental Research Funds for the Central Universities of P R China (Project No. CDJZR10130010), (Project No. CDJXS10131155) and (Project No. CDJZR11135501).

Author information

Authors and Affiliations

  1. College of Material Science and Engineering, Chongqing University, 400044, Chongqing, China

    Cuiping Wu, Jun Shen & Changfei Peng

Authors
  1. Cuiping Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jun Shen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Changfei Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jun Shen.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Wu, C., Shen, J. & Peng, C. Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints. J Mater Sci: Mater Electron 23, 14–21 (2012). https://doi.org/10.1007/s10854-011-0383-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-011-0383-0

Keywords

Search

Navigation