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Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions

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Abstract

The lab-designed drop tests and the pendulum-type impact tests were used to study the effect of high-velocity impact on the fracture morphologies of the Sn3.8Ag0.7Cu (wt. %) solder joints. The U-notch butted-type specimen was selected. The typical fracture morphologies created by the high-velocity tests were compared. It is believed that the large Ag3Sn platelets precipitated at the Cu/solder interfaces after air cooling provided the initiation site for cracking and caused the brittle fracture. Using SEM, the fracture morphologies along the interfacial Ag3Sn intermetallic compounds (IMCs) were observed on the fracture surfaces. The results showed that the fracture morphologies were a function of the stress state and the orientation of the Ag3Sn platelets within the solder joints strongly influenced the fracture morphology.

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Acknowledgments

The present work was performed under the financial support of the National 863 Hi-Tech Scheme (No.2002AA322040) and the key program for the 11th five-Year Plan (No.2006BAE03B02) of the China Department of Science and Technology.

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Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124, Beijing, People’s Republic of China

    Ning Zhang, Yaowu Shi, Fu Guo, Yongpei Lei & Zhidong Xia

  2. R&D Center, China Building Material Test and Certification Center, 1 Guanzhuang Dongli, Chaoyang District, 100024, Beijing, People’s Republic of China

    Li Tian

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  1. Ning Zhang
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  2. Yaowu Shi
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  3. Fu Guo
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  4. Yongpei Lei
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  5. Zhidong Xia
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  6. Li Tian
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Correspondence to Ning Zhang.

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Zhang, N., Shi, Y., Guo, F. et al. Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions. J Mater Sci: Mater Electron 21, 1076–1082 (2010). https://doi.org/10.1007/s10854-010-0093-z

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  • DOI: https://doi.org/10.1007/s10854-010-0093-z

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