Skip to main content
SpringerLink
Log in

Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The effect of Sn-rich coarsening in Sn–Ag–Cu solder joints produced by isothermal annealing was investigated. The isothermal annealing temperatures employed were from 30 to 150 °C for 24 h up to 1,008 h of annealing time. An Infinite Focus Measurement system (IFM®) and Scanning Electron Microscopy-Energy Dispersive Spectroscopy (SEM-EDS) were used for microscopic analysis and elemental analysis, respectively. As the annealing time and temperature increased, a eutectic component Cu, diffused into the Sn-rich phases, coarsening the Sn-rich phases, and the activation energy value for the coarsening was determined to be 41 kJ/mol.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

References

  1. D. Swenson, Materials in electronics. J. Mater. Sci. 18, 39 (2007)

    CAS  Google Scholar 

  2. I. Ahmad, A. Jalar, B.Y. Majlis, R. Wagiran, Int. J. Eng. Technol. 4, 123 (2007)

    Google Scholar 

  3. A.R. Fix, W. Nutcher, J. Wilde, Soldering Surf. Mount Technol. 20, 13 (2008)

    Article  CAS  Google Scholar 

  4. S.K. Kailasam, M.E. Glicksman, S.S. Mani, V.E. Fradkov, Metallurgical Mater. Trans. A 30, 1541 (1999)

    Article  Google Scholar 

  5. S. Kou, Welding Metallurgy (John Wiley & Sons, Inc, New York, 1987), pp. 127–137

    Google Scholar 

  6. D. Lewis, S. Allen, M. Notis, A. Scotch, J. Elec. Mater. 31, 161 (2002)

    Article  CAS  ADS  Google Scholar 

  7. C. Wei, Y. Liu, Z. Gao, J. Wan, C. Ma, J. Elec. Mater. 38, 345 (2009)

    Article  CAS  ADS  Google Scholar 

  8. M. Kajihara, Mater. Sci. Eng. A 403, 234 (2003)

    Google Scholar 

  9. Y.D. Jeon, K.W. Paik, A. Ostmann, H. Reichl, J. Elec. Mater. 34, 80 (2005)

    Article  CAS  ADS  Google Scholar 

  10. W. Peng, W. Peng, E. Monlevade, M.E. Marques, Microelectron. Reliab. 47, 2161 (2007)

    Article  CAS  Google Scholar 

  11. D.Q. Yu, C.M.L. Wu, C.M.T. Law, L. Wang, J.K.L. Lai, J. Alloys Compd. 392, 192 (2005)

    Article  CAS  Google Scholar 

  12. J.W. Yoon, S.B. Jung, J. Mater. Sci. 39, 4211 (2004)

    Article  CAS  ADS  Google Scholar 

  13. Y.C. Liu, J.B. Wan, Z.M. Gao, J. alloys Compd. 465, 205 (2008)

    Article  CAS  Google Scholar 

  14. K.K. Hong, J.Y. Huh, J. Elec. Mater. 35, 56 (2006)

    Article  CAS  ADS  Google Scholar 

Download references

Acknowledgments

This work is supported under the grant UKM-OUP-NBT-26-115/2009. The authors gratefully acknowledge the support provided by the National University of Malaysia and Ministry of Science and Technology (MOSTI).

Author information

Authors and Affiliations

  1. School of Applied Physics, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    N. Saud & A. Jalar

Authors
  1. N. Saud
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. A. Jalar
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to A. Jalar.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Saud, N., Jalar, A. Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder. J Mater Sci: Mater Electron 21, 1083–1089 (2010). https://doi.org/10.1007/s10854-009-0032-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-009-0032-z

Keywords

Search

Navigation