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Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy

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Abstract

The purpose of this study is to investigate the effects of small amounts of Ni, P and Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. The results indicate that adding trace amounts of Ni, P or Ce element has little influence on the melting temperature of Sn3.0Ag0.5Cu solder alloy. Adding Ni or Ce element cannot improve the wettability and anti-oxidization of the Sn3.0Ag0.5Cu solder alloy, but it can depress the interfacial intermetallic compounds growth due to the high temperature aging and then improves the shear strength of the solder joint. In addition, the P element addition not only significantly increases the maximum wetting force and decreases the wetting time of the solder, but also improves the anti-oxidation property of the Sn3.0Ag0.5Cu solder. At the same time, adding P element also increases the hot cracking sensitivity of the solder surface in the solidification. However, it is noted that adding Ni or Ce element can depress the formation of the hot carking. The reason may be related to the modification of the microstructure of the solder alloys due to trace amounts of Ce or Ni elements additions. The adding elements change the microstructure of Sn3.0Ag0.5Cu solder alloy.

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Acknowledgments

The authors greatly acknowledge the financial support from the key program of the State Department of Science and Technology (2006BAE03B02) and the PHR (IHLB) of Beijing Education Committee.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Benjing University of Technology, l00 Ping LeYuan, Chaoyang District, 100124, Beijing, People’s Republic of China

    Wenxing Dong, Yaowu Shi, Yongping Lei, Zhidong Xia & Fu Guo

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  1. Wenxing Dong
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  2. Yaowu Shi
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  3. Yongping Lei
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  4. Zhidong Xia
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  5. Fu Guo
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Correspondence to Wenxing Dong.

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Dong, W., Shi, Y., Lei, Y. et al. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. J Mater Sci: Mater Electron 20, 1008–1017 (2009). https://doi.org/10.1007/s10854-008-9826-7

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  • DOI: https://doi.org/10.1007/s10854-008-9826-7

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